A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface

A 1 Tb 4-b/cell 162-layer 3-D flash memory achieves 15-Gb/mm2 areal density and delivers program throughput up to 60 MB/s and the best case tR of 65 \mu \text{s} by employing 8-kB wordline (WL) central stair structure and contact-through-WL (CTW) architecture. IO speed of 2.4 Gb/s with low tapped...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE journal of solid-state circuits 2023-01, Vol.58 (1), p.316-328
Hauptverfasser: Yuh, Jong Hak, Li, Yen-Lung Jason, Li, Heguang, Oyama, Yoshihiro, Hsu, Cynthia, Anantula, Pradeep, Jeong, Gwang Yeong Stanley, Amarnath, Anirudh, Darne, Siddhesh, Bhatia, Sneha, Tang, Tianyu, Arya, Aditya, Rastogi, Naman, Ookuma, Naoki, Mizukoshi, Hiroyuki, Yap, Alex, Wang, Demin, Kim, Steve, Wu, Yonggang, Peng, Min, Lu, Jason, Ip, Tommy, Malhotra, Seema, Han, Taekeun, Okumura, Masatoshi, Liu, Jiwen, Sohn, Jeongduk John, Chibvongodze, Hardwell, Balaga, Muralikrishna, Matsuda, Akihiro, Chen, Chen, K. V., Indra, G., V. S. N. K. Chaitanya, Ramachandra, Venky, Kato, Yosuke, Kumar, Ravi J., Wang, Huijuan, Moogat, Farookh, Yoon, In-Soo, Kanda, Kazushige, Shimizu, Takahiro, Shibata, Noboru, Yanagidaira, Kosuke, Kodama, Takuyo, Fukuda, Ryo, Hirashima, Yasuhiro, Abe, Mitsuhiro
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 328
container_issue 1
container_start_page 316
container_title IEEE journal of solid-state circuits
container_volume 58
creator Yuh, Jong Hak
Li, Yen-Lung Jason
Li, Heguang
Oyama, Yoshihiro
Hsu, Cynthia
Anantula, Pradeep
Jeong, Gwang Yeong Stanley
Amarnath, Anirudh
Darne, Siddhesh
Bhatia, Sneha
Tang, Tianyu
Arya, Aditya
Rastogi, Naman
Ookuma, Naoki
Mizukoshi, Hiroyuki
Yap, Alex
Wang, Demin
Kim, Steve
Wu, Yonggang
Peng, Min
Lu, Jason
Ip, Tommy
Malhotra, Seema
Han, Taekeun
Okumura, Masatoshi
Liu, Jiwen
Sohn, Jeongduk John
Chibvongodze, Hardwell
Balaga, Muralikrishna
Matsuda, Akihiro
Chen, Chen
K. V., Indra
G., V. S. N. K. Chaitanya
Ramachandra, Venky
Kato, Yosuke
Kumar, Ravi J.
Wang, Huijuan
Moogat, Farookh
Yoon, In-Soo
Kanda, Kazushige
Shimizu, Takahiro
Shibata, Noboru
Yanagidaira, Kosuke
Kodama, Takuyo
Fukuda, Ryo
Hirashima, Yasuhiro
Abe, Mitsuhiro
description A 1 Tb 4-b/cell 162-layer 3-D flash memory achieves 15-Gb/mm2 areal density and delivers program throughput up to 60 MB/s and the best case tR of 65 \mu \text{s} by employing 8-kB wordline (WL) central stair structure and contact-through-WL (CTW) architecture. IO speed of 2.4 Gb/s with low tapped termination/center tapped termination (LTT/CTT) combo driver is supported. This article also discusses data transfer energy reduction using VCCQ domain design and data bus inversion (DBI) technique. Novel time division peak power management (TD-PPM) feature can reduce system peak current while maximizing system performance. Cache and IO discrete Fourier transform (DFT) enable a high-speed testing at wafer level for test cost reduction.
doi_str_mv 10.1109/JSSC.2022.3193326
format Article
fullrecord <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_JSSC_2022_3193326</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>9855391</ieee_id><sourcerecordid>2758723225</sourcerecordid><originalsourceid>FETCH-LOGICAL-c293t-d8964b8b67e5aa679420c8357552a80dcfb1d1f8bbdf2fa1ddf7d4a8c86392183</originalsourceid><addsrcrecordid>eNo9kMFOAjEQhhujiYg-gPHSxHOXznS72x4JCmIgmIDRW9PutgGysNpdDry9SyCe5p_k-2eSj5BH4AkA14P35XKUIEdMBGghMLsiPZBSMcjF9zXpcQ6KaeT8ltw1zbZb01RBj8yHFNjK0ZS5QeGrqgsfld17ChmymT36SAV7oePKNms697s6HunXpl1TTFI2cYOGThd0um99DLbw9-Qm2KrxD5fZJ5_j19Xojc0Wk-loOGMFatGyUuksdcpluZfWZrlOkRdKyFxKtIqXRXBQQlDOlQGDhbIMeZlaVahMaAQl-uT5fPcn1r8H37RmWx_ivntpMJcqR4EoOwrOVBHrpok-mJ-42dl4NMDNyZo5WTMna-Zires8nTsb7_0_r5WUQoP4AytQY1Q</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2758723225</pqid></control><display><type>article</type><title>A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface</title><source>IEEE Electronic Library (IEL)</source><creator>Yuh, Jong Hak ; Li, Yen-Lung Jason ; Li, Heguang ; Oyama, Yoshihiro ; Hsu, Cynthia ; Anantula, Pradeep ; Jeong, Gwang Yeong Stanley ; Amarnath, Anirudh ; Darne, Siddhesh ; Bhatia, Sneha ; Tang, Tianyu ; Arya, Aditya ; Rastogi, Naman ; Ookuma, Naoki ; Mizukoshi, Hiroyuki ; Yap, Alex ; Wang, Demin ; Kim, Steve ; Wu, Yonggang ; Peng, Min ; Lu, Jason ; Ip, Tommy ; Malhotra, Seema ; Han, Taekeun ; Okumura, Masatoshi ; Liu, Jiwen ; Sohn, Jeongduk John ; Chibvongodze, Hardwell ; Balaga, Muralikrishna ; Matsuda, Akihiro ; Chen, Chen ; K. V., Indra ; G., V. S. N. K. Chaitanya ; Ramachandra, Venky ; Kato, Yosuke ; Kumar, Ravi J. ; Wang, Huijuan ; Moogat, Farookh ; Yoon, In-Soo ; Kanda, Kazushige ; Shimizu, Takahiro ; Shibata, Noboru ; Yanagidaira, Kosuke ; Kodama, Takuyo ; Fukuda, Ryo ; Hirashima, Yasuhiro ; Abe, Mitsuhiro</creator><creatorcontrib>Yuh, Jong Hak ; Li, Yen-Lung Jason ; Li, Heguang ; Oyama, Yoshihiro ; Hsu, Cynthia ; Anantula, Pradeep ; Jeong, Gwang Yeong Stanley ; Amarnath, Anirudh ; Darne, Siddhesh ; Bhatia, Sneha ; Tang, Tianyu ; Arya, Aditya ; Rastogi, Naman ; Ookuma, Naoki ; Mizukoshi, Hiroyuki ; Yap, Alex ; Wang, Demin ; Kim, Steve ; Wu, Yonggang ; Peng, Min ; Lu, Jason ; Ip, Tommy ; Malhotra, Seema ; Han, Taekeun ; Okumura, Masatoshi ; Liu, Jiwen ; Sohn, Jeongduk John ; Chibvongodze, Hardwell ; Balaga, Muralikrishna ; Matsuda, Akihiro ; Chen, Chen ; K. V., Indra ; G., V. S. N. K. Chaitanya ; Ramachandra, Venky ; Kato, Yosuke ; Kumar, Ravi J. ; Wang, Huijuan ; Moogat, Farookh ; Yoon, In-Soo ; Kanda, Kazushige ; Shimizu, Takahiro ; Shibata, Noboru ; Yanagidaira, Kosuke ; Kodama, Takuyo ; Fukuda, Ryo ; Hirashima, Yasuhiro ; Abe, Mitsuhiro</creatorcontrib><description>A 1 Tb 4-b/cell 162-layer 3-D flash memory achieves 15-Gb/mm2 areal density and delivers program throughput up to 60 MB/s and the best case tR of 65 &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{s} &lt;/tex-math&gt;&lt;/inline-formula&gt; by employing 8-kB wordline (WL) central stair structure and contact-through-WL (CTW) architecture. IO speed of 2.4 Gb/s with low tapped termination/center tapped termination (LTT/CTT) combo driver is supported. This article also discusses data transfer energy reduction using VCCQ domain design and data bus inversion (DBI) technique. Novel time division peak power management (TD-PPM) feature can reduce system peak current while maximizing system performance. Cache and IO discrete Fourier transform (DFT) enable a high-speed testing at wafer level for test cost reduction.</description><identifier>ISSN: 0018-9200</identifier><identifier>EISSN: 1558-173X</identifier><identifier>DOI: 10.1109/JSSC.2022.3193326</identifier><identifier>CODEN: IJSCBC</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>3-D flash ; Ash ; BiCS flash ; Computer architecture ; Data transfer (computers) ; Decoding ; discrete Fourier transform (DFT) ; Flash memory (computers) ; Fourier transforms ; IO design ; Metals ; NAND ; peak power management (PPM) ; Pins ; Power management ; program throughput ; Throughput ; Transistors ; User interfaces</subject><ispartof>IEEE journal of solid-state circuits, 2023-01, Vol.58 (1), p.316-328</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c293t-d8964b8b67e5aa679420c8357552a80dcfb1d1f8bbdf2fa1ddf7d4a8c86392183</citedby><cites>FETCH-LOGICAL-c293t-d8964b8b67e5aa679420c8357552a80dcfb1d1f8bbdf2fa1ddf7d4a8c86392183</cites><orcidid>0000-0002-8223-9108 ; 0000-0003-0254-6528 ; 0000-0001-7699-6367</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9855391$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9855391$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Yuh, Jong Hak</creatorcontrib><creatorcontrib>Li, Yen-Lung Jason</creatorcontrib><creatorcontrib>Li, Heguang</creatorcontrib><creatorcontrib>Oyama, Yoshihiro</creatorcontrib><creatorcontrib>Hsu, Cynthia</creatorcontrib><creatorcontrib>Anantula, Pradeep</creatorcontrib><creatorcontrib>Jeong, Gwang Yeong Stanley</creatorcontrib><creatorcontrib>Amarnath, Anirudh</creatorcontrib><creatorcontrib>Darne, Siddhesh</creatorcontrib><creatorcontrib>Bhatia, Sneha</creatorcontrib><creatorcontrib>Tang, Tianyu</creatorcontrib><creatorcontrib>Arya, Aditya</creatorcontrib><creatorcontrib>Rastogi, Naman</creatorcontrib><creatorcontrib>Ookuma, Naoki</creatorcontrib><creatorcontrib>Mizukoshi, Hiroyuki</creatorcontrib><creatorcontrib>Yap, Alex</creatorcontrib><creatorcontrib>Wang, Demin</creatorcontrib><creatorcontrib>Kim, Steve</creatorcontrib><creatorcontrib>Wu, Yonggang</creatorcontrib><creatorcontrib>Peng, Min</creatorcontrib><creatorcontrib>Lu, Jason</creatorcontrib><creatorcontrib>Ip, Tommy</creatorcontrib><creatorcontrib>Malhotra, Seema</creatorcontrib><creatorcontrib>Han, Taekeun</creatorcontrib><creatorcontrib>Okumura, Masatoshi</creatorcontrib><creatorcontrib>Liu, Jiwen</creatorcontrib><creatorcontrib>Sohn, Jeongduk John</creatorcontrib><creatorcontrib>Chibvongodze, Hardwell</creatorcontrib><creatorcontrib>Balaga, Muralikrishna</creatorcontrib><creatorcontrib>Matsuda, Akihiro</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>K. V., Indra</creatorcontrib><creatorcontrib>G., V. S. N. K. Chaitanya</creatorcontrib><creatorcontrib>Ramachandra, Venky</creatorcontrib><creatorcontrib>Kato, Yosuke</creatorcontrib><creatorcontrib>Kumar, Ravi J.</creatorcontrib><creatorcontrib>Wang, Huijuan</creatorcontrib><creatorcontrib>Moogat, Farookh</creatorcontrib><creatorcontrib>Yoon, In-Soo</creatorcontrib><creatorcontrib>Kanda, Kazushige</creatorcontrib><creatorcontrib>Shimizu, Takahiro</creatorcontrib><creatorcontrib>Shibata, Noboru</creatorcontrib><creatorcontrib>Yanagidaira, Kosuke</creatorcontrib><creatorcontrib>Kodama, Takuyo</creatorcontrib><creatorcontrib>Fukuda, Ryo</creatorcontrib><creatorcontrib>Hirashima, Yasuhiro</creatorcontrib><creatorcontrib>Abe, Mitsuhiro</creatorcontrib><title>A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface</title><title>IEEE journal of solid-state circuits</title><addtitle>JSSC</addtitle><description>A 1 Tb 4-b/cell 162-layer 3-D flash memory achieves 15-Gb/mm2 areal density and delivers program throughput up to 60 MB/s and the best case tR of 65 &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{s} &lt;/tex-math&gt;&lt;/inline-formula&gt; by employing 8-kB wordline (WL) central stair structure and contact-through-WL (CTW) architecture. IO speed of 2.4 Gb/s with low tapped termination/center tapped termination (LTT/CTT) combo driver is supported. This article also discusses data transfer energy reduction using VCCQ domain design and data bus inversion (DBI) technique. Novel time division peak power management (TD-PPM) feature can reduce system peak current while maximizing system performance. Cache and IO discrete Fourier transform (DFT) enable a high-speed testing at wafer level for test cost reduction.</description><subject>3-D flash</subject><subject>Ash</subject><subject>BiCS flash</subject><subject>Computer architecture</subject><subject>Data transfer (computers)</subject><subject>Decoding</subject><subject>discrete Fourier transform (DFT)</subject><subject>Flash memory (computers)</subject><subject>Fourier transforms</subject><subject>IO design</subject><subject>Metals</subject><subject>NAND</subject><subject>peak power management (PPM)</subject><subject>Pins</subject><subject>Power management</subject><subject>program throughput</subject><subject>Throughput</subject><subject>Transistors</subject><subject>User interfaces</subject><issn>0018-9200</issn><issn>1558-173X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kMFOAjEQhhujiYg-gPHSxHOXznS72x4JCmIgmIDRW9PutgGysNpdDry9SyCe5p_k-2eSj5BH4AkA14P35XKUIEdMBGghMLsiPZBSMcjF9zXpcQ6KaeT8ltw1zbZb01RBj8yHFNjK0ZS5QeGrqgsfld17ChmymT36SAV7oePKNms697s6HunXpl1TTFI2cYOGThd0um99DLbw9-Qm2KrxD5fZJ5_j19Xojc0Wk-loOGMFatGyUuksdcpluZfWZrlOkRdKyFxKtIqXRXBQQlDOlQGDhbIMeZlaVahMaAQl-uT5fPcn1r8H37RmWx_ivntpMJcqR4EoOwrOVBHrpok-mJ-42dl4NMDNyZo5WTMna-Zires8nTsb7_0_r5WUQoP4AytQY1Q</recordid><startdate>20230101</startdate><enddate>20230101</enddate><creator>Yuh, Jong Hak</creator><creator>Li, Yen-Lung Jason</creator><creator>Li, Heguang</creator><creator>Oyama, Yoshihiro</creator><creator>Hsu, Cynthia</creator><creator>Anantula, Pradeep</creator><creator>Jeong, Gwang Yeong Stanley</creator><creator>Amarnath, Anirudh</creator><creator>Darne, Siddhesh</creator><creator>Bhatia, Sneha</creator><creator>Tang, Tianyu</creator><creator>Arya, Aditya</creator><creator>Rastogi, Naman</creator><creator>Ookuma, Naoki</creator><creator>Mizukoshi, Hiroyuki</creator><creator>Yap, Alex</creator><creator>Wang, Demin</creator><creator>Kim, Steve</creator><creator>Wu, Yonggang</creator><creator>Peng, Min</creator><creator>Lu, Jason</creator><creator>Ip, Tommy</creator><creator>Malhotra, Seema</creator><creator>Han, Taekeun</creator><creator>Okumura, Masatoshi</creator><creator>Liu, Jiwen</creator><creator>Sohn, Jeongduk John</creator><creator>Chibvongodze, Hardwell</creator><creator>Balaga, Muralikrishna</creator><creator>Matsuda, Akihiro</creator><creator>Chen, Chen</creator><creator>K. V., Indra</creator><creator>G., V. S. N. K. Chaitanya</creator><creator>Ramachandra, Venky</creator><creator>Kato, Yosuke</creator><creator>Kumar, Ravi J.</creator><creator>Wang, Huijuan</creator><creator>Moogat, Farookh</creator><creator>Yoon, In-Soo</creator><creator>Kanda, Kazushige</creator><creator>Shimizu, Takahiro</creator><creator>Shibata, Noboru</creator><creator>Yanagidaira, Kosuke</creator><creator>Kodama, Takuyo</creator><creator>Fukuda, Ryo</creator><creator>Hirashima, Yasuhiro</creator><creator>Abe, Mitsuhiro</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-8223-9108</orcidid><orcidid>https://orcid.org/0000-0003-0254-6528</orcidid><orcidid>https://orcid.org/0000-0001-7699-6367</orcidid></search><sort><creationdate>20230101</creationdate><title>A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface</title><author>Yuh, Jong Hak ; Li, Yen-Lung Jason ; Li, Heguang ; Oyama, Yoshihiro ; Hsu, Cynthia ; Anantula, Pradeep ; Jeong, Gwang Yeong Stanley ; Amarnath, Anirudh ; Darne, Siddhesh ; Bhatia, Sneha ; Tang, Tianyu ; Arya, Aditya ; Rastogi, Naman ; Ookuma, Naoki ; Mizukoshi, Hiroyuki ; Yap, Alex ; Wang, Demin ; Kim, Steve ; Wu, Yonggang ; Peng, Min ; Lu, Jason ; Ip, Tommy ; Malhotra, Seema ; Han, Taekeun ; Okumura, Masatoshi ; Liu, Jiwen ; Sohn, Jeongduk John ; Chibvongodze, Hardwell ; Balaga, Muralikrishna ; Matsuda, Akihiro ; Chen, Chen ; K. V., Indra ; G., V. S. N. K. Chaitanya ; Ramachandra, Venky ; Kato, Yosuke ; Kumar, Ravi J. ; Wang, Huijuan ; Moogat, Farookh ; Yoon, In-Soo ; Kanda, Kazushige ; Shimizu, Takahiro ; Shibata, Noboru ; Yanagidaira, Kosuke ; Kodama, Takuyo ; Fukuda, Ryo ; Hirashima, Yasuhiro ; Abe, Mitsuhiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c293t-d8964b8b67e5aa679420c8357552a80dcfb1d1f8bbdf2fa1ddf7d4a8c86392183</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>3-D flash</topic><topic>Ash</topic><topic>BiCS flash</topic><topic>Computer architecture</topic><topic>Data transfer (computers)</topic><topic>Decoding</topic><topic>discrete Fourier transform (DFT)</topic><topic>Flash memory (computers)</topic><topic>Fourier transforms</topic><topic>IO design</topic><topic>Metals</topic><topic>NAND</topic><topic>peak power management (PPM)</topic><topic>Pins</topic><topic>Power management</topic><topic>program throughput</topic><topic>Throughput</topic><topic>Transistors</topic><topic>User interfaces</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yuh, Jong Hak</creatorcontrib><creatorcontrib>Li, Yen-Lung Jason</creatorcontrib><creatorcontrib>Li, Heguang</creatorcontrib><creatorcontrib>Oyama, Yoshihiro</creatorcontrib><creatorcontrib>Hsu, Cynthia</creatorcontrib><creatorcontrib>Anantula, Pradeep</creatorcontrib><creatorcontrib>Jeong, Gwang Yeong Stanley</creatorcontrib><creatorcontrib>Amarnath, Anirudh</creatorcontrib><creatorcontrib>Darne, Siddhesh</creatorcontrib><creatorcontrib>Bhatia, Sneha</creatorcontrib><creatorcontrib>Tang, Tianyu</creatorcontrib><creatorcontrib>Arya, Aditya</creatorcontrib><creatorcontrib>Rastogi, Naman</creatorcontrib><creatorcontrib>Ookuma, Naoki</creatorcontrib><creatorcontrib>Mizukoshi, Hiroyuki</creatorcontrib><creatorcontrib>Yap, Alex</creatorcontrib><creatorcontrib>Wang, Demin</creatorcontrib><creatorcontrib>Kim, Steve</creatorcontrib><creatorcontrib>Wu, Yonggang</creatorcontrib><creatorcontrib>Peng, Min</creatorcontrib><creatorcontrib>Lu, Jason</creatorcontrib><creatorcontrib>Ip, Tommy</creatorcontrib><creatorcontrib>Malhotra, Seema</creatorcontrib><creatorcontrib>Han, Taekeun</creatorcontrib><creatorcontrib>Okumura, Masatoshi</creatorcontrib><creatorcontrib>Liu, Jiwen</creatorcontrib><creatorcontrib>Sohn, Jeongduk John</creatorcontrib><creatorcontrib>Chibvongodze, Hardwell</creatorcontrib><creatorcontrib>Balaga, Muralikrishna</creatorcontrib><creatorcontrib>Matsuda, Akihiro</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>K. V., Indra</creatorcontrib><creatorcontrib>G., V. S. N. K. Chaitanya</creatorcontrib><creatorcontrib>Ramachandra, Venky</creatorcontrib><creatorcontrib>Kato, Yosuke</creatorcontrib><creatorcontrib>Kumar, Ravi J.</creatorcontrib><creatorcontrib>Wang, Huijuan</creatorcontrib><creatorcontrib>Moogat, Farookh</creatorcontrib><creatorcontrib>Yoon, In-Soo</creatorcontrib><creatorcontrib>Kanda, Kazushige</creatorcontrib><creatorcontrib>Shimizu, Takahiro</creatorcontrib><creatorcontrib>Shibata, Noboru</creatorcontrib><creatorcontrib>Yanagidaira, Kosuke</creatorcontrib><creatorcontrib>Kodama, Takuyo</creatorcontrib><creatorcontrib>Fukuda, Ryo</creatorcontrib><creatorcontrib>Hirashima, Yasuhiro</creatorcontrib><creatorcontrib>Abe, Mitsuhiro</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE journal of solid-state circuits</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yuh, Jong Hak</au><au>Li, Yen-Lung Jason</au><au>Li, Heguang</au><au>Oyama, Yoshihiro</au><au>Hsu, Cynthia</au><au>Anantula, Pradeep</au><au>Jeong, Gwang Yeong Stanley</au><au>Amarnath, Anirudh</au><au>Darne, Siddhesh</au><au>Bhatia, Sneha</au><au>Tang, Tianyu</au><au>Arya, Aditya</au><au>Rastogi, Naman</au><au>Ookuma, Naoki</au><au>Mizukoshi, Hiroyuki</au><au>Yap, Alex</au><au>Wang, Demin</au><au>Kim, Steve</au><au>Wu, Yonggang</au><au>Peng, Min</au><au>Lu, Jason</au><au>Ip, Tommy</au><au>Malhotra, Seema</au><au>Han, Taekeun</au><au>Okumura, Masatoshi</au><au>Liu, Jiwen</au><au>Sohn, Jeongduk John</au><au>Chibvongodze, Hardwell</au><au>Balaga, Muralikrishna</au><au>Matsuda, Akihiro</au><au>Chen, Chen</au><au>K. V., Indra</au><au>G., V. S. N. K. Chaitanya</au><au>Ramachandra, Venky</au><au>Kato, Yosuke</au><au>Kumar, Ravi J.</au><au>Wang, Huijuan</au><au>Moogat, Farookh</au><au>Yoon, In-Soo</au><au>Kanda, Kazushige</au><au>Shimizu, Takahiro</au><au>Shibata, Noboru</au><au>Yanagidaira, Kosuke</au><au>Kodama, Takuyo</au><au>Fukuda, Ryo</au><au>Hirashima, Yasuhiro</au><au>Abe, Mitsuhiro</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface</atitle><jtitle>IEEE journal of solid-state circuits</jtitle><stitle>JSSC</stitle><date>2023-01-01</date><risdate>2023</risdate><volume>58</volume><issue>1</issue><spage>316</spage><epage>328</epage><pages>316-328</pages><issn>0018-9200</issn><eissn>1558-173X</eissn><coden>IJSCBC</coden><abstract>A 1 Tb 4-b/cell 162-layer 3-D flash memory achieves 15-Gb/mm2 areal density and delivers program throughput up to 60 MB/s and the best case tR of 65 &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{s} &lt;/tex-math&gt;&lt;/inline-formula&gt; by employing 8-kB wordline (WL) central stair structure and contact-through-WL (CTW) architecture. IO speed of 2.4 Gb/s with low tapped termination/center tapped termination (LTT/CTT) combo driver is supported. This article also discusses data transfer energy reduction using VCCQ domain design and data bus inversion (DBI) technique. Novel time division peak power management (TD-PPM) feature can reduce system peak current while maximizing system performance. Cache and IO discrete Fourier transform (DFT) enable a high-speed testing at wafer level for test cost reduction.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSSC.2022.3193326</doi><tpages>13</tpages><orcidid>https://orcid.org/0000-0002-8223-9108</orcidid><orcidid>https://orcid.org/0000-0003-0254-6528</orcidid><orcidid>https://orcid.org/0000-0001-7699-6367</orcidid></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 0018-9200
ispartof IEEE journal of solid-state circuits, 2023-01, Vol.58 (1), p.316-328
issn 0018-9200
1558-173X
language eng
recordid cdi_crossref_primary_10_1109_JSSC_2022_3193326
source IEEE Electronic Library (IEL)
subjects 3-D flash
Ash
BiCS flash
Computer architecture
Data transfer (computers)
Decoding
discrete Fourier transform (DFT)
Flash memory (computers)
Fourier transforms
IO design
Metals
NAND
peak power management (PPM)
Pins
Power management
program throughput
Throughput
Transistors
User interfaces
title A 1-Tb 4-b/cell 4-Plane 162-Layer 3-D Flash Memory With 2.4-Gb/s IO Interface
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T21%3A08%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%201-Tb%204-b/cell%204-Plane%20162-Layer%203-D%20Flash%20Memory%20With%202.4-Gb/s%20IO%20Interface&rft.jtitle=IEEE%20journal%20of%20solid-state%20circuits&rft.au=Yuh,%20Jong%20Hak&rft.date=2023-01-01&rft.volume=58&rft.issue=1&rft.spage=316&rft.epage=328&rft.pages=316-328&rft.issn=0018-9200&rft.eissn=1558-173X&rft.coden=IJSCBC&rft_id=info:doi/10.1109/JSSC.2022.3193326&rft_dat=%3Cproquest_RIE%3E2758723225%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2758723225&rft_id=info:pmid/&rft_ieee_id=9855391&rfr_iscdi=true