A 1.95 GHz Fully Integrated Envelope Elimination and Restoration CMOS Power Amplifier Using Timing Alignment Technique for WCDMA and LTE

A fully integrated envelope elimination and restoration (EER) CMOS power amplifier (PA) has been developed for WCDMA and LTE handsets. EER is a supply modulation technique that first divides modulated RF signal into envelope and phase signals and then restores it at a switching PA output. Supply vol...

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Veröffentlicht in:IEEE journal of solid-state circuits 2014-12, Vol.49 (12), p.2915-2924
Hauptverfasser: Oishi, Kazuaki, Yoshida, Eiji, Sakai, Yasufumi, Takauchi, Hideki, Kawano, Yoichi, Shirai, Noriaki, Kano, Hideki, Kudo, Masahiro, Murakami, Tomotoshi, Tamura, Tetsuro, Kawai, Shigeaki, Suto, Kazuo, Yamazaki, Hiroshi, Mori, Toshihiko
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Sprache:eng
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Zusammenfassung:A fully integrated envelope elimination and restoration (EER) CMOS power amplifier (PA) has been developed for WCDMA and LTE handsets. EER is a supply modulation technique that first divides modulated RF signal into envelope and phase signals and then restores it at a switching PA output. Supply voltage of the switching PA is modulated by the envelope signal through a high-speed supply modulator. EER PA is highly efficient due to the switching PA and the supply modulation. However, it generally has difficulty, especially for a wide bandwidth baseband application like LTE, achieving a wide bandwidth for phase signal path and highly accurate timing between envelope and phase signals. To overcome these challenges, an envelope/phase generator based on a mixer and a limiter was proposed to generate the wide bandwidth phase signal, and a timing aligner based on a delay locked loop with a variable high-pass filter (HPF) was proposed to compensate for the timing mismatch. The chip was implemented in 90 nm CMOS technology. Measured power-added efficiency (PAE) and adjacent channel leakage ratio (ACLR) were 39% and -41 dBc for WCDMA, and measured PAE and ACLR E-UTRA1 were 32% and -33 dBc for 20 MHz-BW LTE.
ISSN:0018-9200
1558-173X
DOI:10.1109/JSSC.2014.2358554