Novel Group-IV Alloy-based MOS Field-Effect Phototransistors for Near-Infrared Applications

This work describes the novel Si 1-x Sn x alloy-based n -metal-oxide-semiconductor phototransistors (nMOSPTs) grown on silicon (Si) substrate via Si 1-x Sn x ( x =3.6%) virtual substrate (VS) for near-infrared (NIR) applications. The concept of transferring high-speed optical signals directly to the...

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Veröffentlicht in:IEEE sensors journal 2023-08, Vol.23 (15), p.1-1
Hauptverfasser: Agarwal, Bhavika, Kumar, Harshvardhan
Format: Artikel
Sprache:eng
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Zusammenfassung:This work describes the novel Si 1-x Sn x alloy-based n -metal-oxide-semiconductor phototransistors (nMOSPTs) grown on silicon (Si) substrate via Si 1-x Sn x ( x =3.6%) virtual substrate (VS) for near-infrared (NIR) applications. The concept of transferring high-speed optical signals directly to the complementary metal-oxide-semiconductor (CMOS) photodetector paves the way for novel applications of light to aid electrical functions. As a channel material, SiSn is used in the proposed device's structure. For the purpose of fabricating CMOS devices, the key benefit of using SiSn as a channel material is that it is inexpensive and compatible with Si substrates. In this study, SiSn with 3.6% Sn is introduced as a VS to minimize the lattice mismatch between the Si substrate and Si 1-x Sn x with x =5%- 24% active layer. The bandgap shrinks as Sn is incorporated into Si, which results in a wavelength redshift. As a result, the photodetection range shifts toward a longer wavelength. Moreover, the Sn alloying results in a high absorption coefficient, which increases the responsivity of the device. The designed device is simulated using a commercially available multiphysics tool. The proposed device with a 1000 nm channel length, shows the responsivity and bandwidth of 15.8 A/W and 4.8 GHz, respectively at λ = 850 nm with V GS = V DS = 1 V for x =5%. By increasing the Sn concentration to 24% and gate and drain voltages to 4V, the proposed device achieves the responsivity and bandwidth of 2260 A/W and 61.7 GHz, respectively. Furthermore, it is expected that miniaturization would enhance future devices' responsivity and bandwidth.
ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2023.3287880