Plasma formation of buffer layers for multilayer resist structures

Plasma formation of buffer layers for multilayer resist structures

Recently, Li and Richards described a plasma treatment which may be used to prevent intermixing of successive layers of positive resists. We have studied the characteristics of the fluorinated polymer layers produced by this process, and have used a modification of the process to perform multilayer...

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Veröffentlicht in:IEEE electron device letters 1981-09, Vol.2 (9), p.222-224
Hauptverfasser: Dobkin, D.M., Cantos, B.D.
Format: Artikel
Sprache:eng
Schlagworte:
Buffer layers
Etching
Fabrication
Nonhomogeneous media
Plasma applications
Plasma displays
Plasma measurements
Plasma properties
Resists
Surface treatment
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Beschreibung
Zusammenfassung:Recently, Li and Richards described a plasma treatment which may be used to prevent intermixing of successive layers of positive resists. We have studied the characteristics of the fluorinated polymer layers produced by this process, and have used a modification of the process to perform multilayer lithography for device fabrication.
ISSN:0741-3106
1558-0563
DOI:10.1109/EDL.1981.25411