Design of 0.35-mm pitch QFP lead and its assembly technology

Design of 0.35-mm pitch QFP lead and its assembly technology

The solder joint reliability of a 0.35-mm lead pitch, 42-mm wide/spl times/42-mm long/spl times/23-mm high, 396 pin, ceramic quad flat package (QFP) was studied in terms of: 1) finite element analysis simulation; and 2) temperature cycling tests between -65/spl deg/C and +125/spl deg/C. Using the st...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1995-08, Vol.18 (3), p.456-462
Hauptverfasser: Totani, M., Teshima, Y., Ito, N., Nagatake, M., Otaguro, H.
Format: Artikel
Sprache:eng
Schlagworte:
Analytical models
Assembly
Ceramics
Design optimization
Electronics packaging
Finite element methods
Lead
Soldering
Temperature
Testing
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The solder joint reliability of a 0.35-mm lead pitch, 42-mm wide/spl times/42-mm long/spl times/23-mm high, 396 pin, ceramic quad flat package (QFP) was studied in terms of: 1) finite element analysis simulation; and 2) temperature cycling tests between -65/spl deg/C and +125/spl deg/C. Using the study results, physical design of the QFP leads, in terms of thickness, standoff, and Au surface finish were optimized. If the von Mises stress of a QFP solder joint can be optimized to be no more 16.7 kilogram square millimeter, we can guarantee QFP solder joint reliability over requested design life. Also, we developed a thermocompression (T/C) soldering process for the QFP.< >
ISSN:1070-9894
1558-3686
DOI:10.1109/96.404103