Characterization and improvement of a YBCO multilayer film process for HTS circuit applications

We have developed a 2" multilayer HTS integrated circuit process which contains up to three superconducting YBCO layers, epitaxial dielectric (SrTiO/sub 3/ or SrTiO/sub 3/+Sr/sub 2/AlTaO/sub 6/ combination), Ag wiring, an integrated resistor and non-epitaxial Si/sub x/N/sub y/ dielectric. We ha...

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Veröffentlicht in:IEEE transactions on applied superconductivity 1997-06, Vol.7 (2), p.2057-2062
Hauptverfasser: Pettiette-Hall, C.L., Murduck, J., Burch, J.F., Sergant, M., Hu, R., Cordrump, J., Luong, M., Ellis, R.K.
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Sprache:eng
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Zusammenfassung:We have developed a 2" multilayer HTS integrated circuit process which contains up to three superconducting YBCO layers, epitaxial dielectric (SrTiO/sub 3/ or SrTiO/sub 3/+Sr/sub 2/AlTaO/sub 6/ combination), Ag wiring, an integrated resistor and non-epitaxial Si/sub x/N/sub y/ dielectric. We have incorporated the use of n-factorial and Taguchi designed experiments to develop and optimize various aspects of this process. This article highlights the designed experiments which addressed fabrication issues for HTS superconducting crossovers, dielectric integrity, and HTS/Ag metal contact resistance.
ISSN:1051-8223
1558-2515
DOI:10.1109/77.620995