Innovative ESD thermoplastic composites structured through melt flow processing
The amount of carbon black required to impart electrical conductivity to an insulating polymer can be dramatically reduced by its selective localization in a multi-component system which includes the insulating polymer The present report describes property-structure relationships of polypropylene/ny...
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Veröffentlicht in: | IEEE transactions on electronics packaging manufacturing 2000-10, Vol.23 (4), p.239-245 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The amount of carbon black required to impart electrical conductivity to an insulating polymer can be dramatically reduced by its selective localization in a multi-component system which includes the insulating polymer The present report describes property-structure relationships of polypropylene/nylon/glass fiber (PP/PA/GF) composites with consistent resistivity levels within the 10/sup 6/-10/sup 9/ ohms/sq range achieved at very low carbon black loadings (less than 2%). The quaternary composites studied structure spontaneously during the hot compounding/processing steps and have unique triple-percolation structures. The results were compared with typical carbon black filled materials, which usually contain 15 to 20 wt% carbon black and are too conductive to meet the 10/sup 6/-10/sup 9/ ohms/sq range. |
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ISSN: | 1521-334X 1558-0822 |
DOI: | 10.1109/6104.895067 |