Novel cleaning solutions for polysilicon film post chemical mechanical polishing

Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH/sub 4/OH+H/sub 2/O) alkaline aqueous solution to enhance removal of meta...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE electron device letters 2000-07, Vol.21 (7), p.338-340
Hauptverfasser:	Tung Ming Pan, Tan Fu Lei, Chao Chyi Chen, Tien Sheng Chao, Ming Chi Liaw, Wen Lu Yang, Ming Shih Tsai, Lu, C.P., Chang, W.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Acetic acid Alkaline cleaning Ammonium hydroxide Aqueous solutions Brushes Chaos Chemicals Cleaning Contamination Diamines Electric variables Ethylene Goniometers Impurities Mechanical polishing Pollution measurement Silicon Surface contamination
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!