Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics

Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species...

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Veröffentlicht in:IEEE journal of quantum electronics 1991-01, Vol.27 (1), p.95-100
Hauptverfasser: Phillips, H., Kubodera, S., Sauerbrey, R., Tittel, F.K., Wisoff, P.J.
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container_issue 1
container_start_page 95
container_title IEEE journal of quantum electronics
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creator Phillips, H.
Kubodera, S.
Sauerbrey, R.
Tittel, F.K.
Wisoff, P.J.
description Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.< >
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Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.&lt; &gt;</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/3.73546</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record>
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subjects 640410 - Fluid Physics- General Fluid Dynamics
CHARGED PARTICLES
CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
DESIGN
ELECTRIC DISCHARGES
ELECTROMAGNETIC RADIATION
ELEMENTS
ENERGY LEVELS
Exact sciences and technology
EXCITED STATES
Fault location
FLUIDS
FLUORIDES
FLUORINE COMPOUNDS
FLUORINE IONS
FREQUENCY RANGE
GASES
HALIDES
HALOGEN COMPOUNDS
HZ RANGE
IONS
JETS
Laser excitation
MICROELECTRONICS
NITROGEN COMPOUNDS
NITROGEN FLUORIDES
Noise measurement
NOZZLES
Orifices
Physics
Physics of gases, plasmas and electric discharges
Physics of plasmas and electric discharges
PLASMA
Plasma applications
PULSES
RADIATIONS
SEMIMETALS
SILICON
SPECTROSCOPY
Sputter etching
SPUTTERING
USES
VACUUM SYSTEMS
Valves
VISIBLE RADIATION
title Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics
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