Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics
Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species...
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Veröffentlicht in: | IEEE journal of quantum electronics 1991-01, Vol.27 (1), p.95-100 |
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creator | Phillips, H. Kubodera, S. Sauerbrey, R. Tittel, F.K. Wisoff, P.J. |
description | Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.< > |
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Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.< ></description><identifier>ISSN: 0018-9197</identifier><identifier>EISSN: 1558-1713</identifier><identifier>DOI: 10.1109/3.73546</identifier><identifier>CODEN: IEJQA7</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>640410 - Fluid Physics- General Fluid Dynamics ; CHARGED PARTICLES ; CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY ; DESIGN ; ELECTRIC DISCHARGES ; ELECTROMAGNETIC RADIATION ; ELEMENTS ; ENERGY LEVELS ; Exact sciences and technology ; EXCITED STATES ; Fault location ; FLUIDS ; FLUORIDES ; FLUORINE COMPOUNDS ; FLUORINE IONS ; FREQUENCY RANGE ; GASES ; HALIDES ; HALOGEN COMPOUNDS ; HZ RANGE ; IONS ; JETS ; Laser excitation ; MICROELECTRONICS ; NITROGEN COMPOUNDS ; NITROGEN FLUORIDES ; Noise measurement ; NOZZLES ; Orifices ; Physics ; Physics of gases, plasmas and electric discharges ; Physics of plasmas and electric discharges ; PLASMA ; Plasma applications ; PULSES ; RADIATIONS ; SEMIMETALS ; SILICON ; SPECTROSCOPY ; Sputter etching ; SPUTTERING ; USES ; VACUUM SYSTEMS ; Valves ; VISIBLE RADIATION</subject><ispartof>IEEE journal of quantum electronics, 1991-01, Vol.27 (1), p.95-100</ispartof><rights>1992 INIST-CNRS</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c458t-59b0fd8ef9c9642efc084bfa2197afcd00ec3e680ff36b5459037beadf02c5533</citedby><cites>FETCH-LOGICAL-c458t-59b0fd8ef9c9642efc084bfa2197afcd00ec3e680ff36b5459037beadf02c5533</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/73546$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>230,314,776,780,792,881,4010,27900,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/73546$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=5032231$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/5699081$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Phillips, H.</creatorcontrib><creatorcontrib>Kubodera, S.</creatorcontrib><creatorcontrib>Sauerbrey, R.</creatorcontrib><creatorcontrib>Tittel, F.K.</creatorcontrib><creatorcontrib>Wisoff, P.J.</creatorcontrib><title>Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics</title><title>IEEE journal of quantum electronics</title><addtitle>JQE</addtitle><description>Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.< ></description><subject>640410 - Fluid Physics- General Fluid Dynamics</subject><subject>CHARGED PARTICLES</subject><subject>CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY</subject><subject>DESIGN</subject><subject>ELECTRIC DISCHARGES</subject><subject>ELECTROMAGNETIC RADIATION</subject><subject>ELEMENTS</subject><subject>ENERGY LEVELS</subject><subject>Exact sciences and technology</subject><subject>EXCITED STATES</subject><subject>Fault location</subject><subject>FLUIDS</subject><subject>FLUORIDES</subject><subject>FLUORINE COMPOUNDS</subject><subject>FLUORINE IONS</subject><subject>FREQUENCY RANGE</subject><subject>GASES</subject><subject>HALIDES</subject><subject>HALOGEN COMPOUNDS</subject><subject>HZ RANGE</subject><subject>IONS</subject><subject>JETS</subject><subject>Laser excitation</subject><subject>MICROELECTRONICS</subject><subject>NITROGEN COMPOUNDS</subject><subject>NITROGEN FLUORIDES</subject><subject>Noise measurement</subject><subject>NOZZLES</subject><subject>Orifices</subject><subject>Physics</subject><subject>Physics of gases, plasmas and electric discharges</subject><subject>Physics of plasmas and electric discharges</subject><subject>PLASMA</subject><subject>Plasma applications</subject><subject>PULSES</subject><subject>RADIATIONS</subject><subject>SEMIMETALS</subject><subject>SILICON</subject><subject>SPECTROSCOPY</subject><subject>Sputter etching</subject><subject>SPUTTERING</subject><subject>USES</subject><subject>VACUUM SYSTEMS</subject><subject>Valves</subject><subject>VISIBLE RADIATION</subject><issn>0018-9197</issn><issn>1558-1713</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1991</creationdate><recordtype>article</recordtype><recordid>eNqNkc1v1DAQxS1UJJaCOHOzEKKnFH_EWfuIVqWtVIkL7dXyTsbgKomDJ3to_3q8TdVzT6PR_N6bNxrGPklxLqVw3_X5Vpu2e8M20hjbyK3UJ2wjhLSNk277jr0nuq9t21qxYcPubygBFizpMSwpTzxHPg-BxkA8ljzywOfDQNjze1x4nwiq4A_ymAsP8zwkeJIRv7u94zQjLCUT5PmBh6nnY4LqgVUzJaAP7G0M1evjcz1ltz8vfu-umptfl9e7HzcNtMYujXF7EXuL0YHrWoURhG33MagaP0TohUDQ2FkRo-72pjVO6O0eQx-FAmO0PmVfVt9MS_IEaakJIE9TTedN55ywskLfVmgu-d8BafFjPQ6HIUyYD-SVVbJ9FWikUlIc156tYL2ZqGD0c0ljKA9eCn_8jdf-6TeV_PpsGQjCEEuYINELboRWSh83f16xhIgv09XiP2XRlxE</recordid><startdate>199101</startdate><enddate>199101</enddate><creator>Phillips, H.</creator><creator>Kubodera, S.</creator><creator>Sauerbrey, R.</creator><creator>Tittel, F.K.</creator><creator>Wisoff, P.J.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7SP</scope><scope>7U5</scope><scope>OTOTI</scope></search><sort><creationdate>199101</creationdate><title>Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics</title><author>Phillips, H. ; Kubodera, S. ; Sauerbrey, R. ; Tittel, F.K. ; Wisoff, P.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c458t-59b0fd8ef9c9642efc084bfa2197afcd00ec3e680ff36b5459037beadf02c5533</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1991</creationdate><topic>640410 - Fluid Physics- General Fluid Dynamics</topic><topic>CHARGED PARTICLES</topic><topic>CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY</topic><topic>DESIGN</topic><topic>ELECTRIC DISCHARGES</topic><topic>ELECTROMAGNETIC RADIATION</topic><topic>ELEMENTS</topic><topic>ENERGY LEVELS</topic><topic>Exact sciences and technology</topic><topic>EXCITED STATES</topic><topic>Fault location</topic><topic>FLUIDS</topic><topic>FLUORIDES</topic><topic>FLUORINE COMPOUNDS</topic><topic>FLUORINE IONS</topic><topic>FREQUENCY RANGE</topic><topic>GASES</topic><topic>HALIDES</topic><topic>HALOGEN COMPOUNDS</topic><topic>HZ RANGE</topic><topic>IONS</topic><topic>JETS</topic><topic>Laser excitation</topic><topic>MICROELECTRONICS</topic><topic>NITROGEN COMPOUNDS</topic><topic>NITROGEN FLUORIDES</topic><topic>Noise measurement</topic><topic>NOZZLES</topic><topic>Orifices</topic><topic>Physics</topic><topic>Physics of gases, plasmas and electric discharges</topic><topic>Physics of plasmas and electric discharges</topic><topic>PLASMA</topic><topic>Plasma applications</topic><topic>PULSES</topic><topic>RADIATIONS</topic><topic>SEMIMETALS</topic><topic>SILICON</topic><topic>SPECTROSCOPY</topic><topic>Sputter etching</topic><topic>SPUTTERING</topic><topic>USES</topic><topic>VACUUM SYSTEMS</topic><topic>Valves</topic><topic>VISIBLE RADIATION</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Phillips, H.</creatorcontrib><creatorcontrib>Kubodera, S.</creatorcontrib><creatorcontrib>Sauerbrey, R.</creatorcontrib><creatorcontrib>Tittel, F.K.</creatorcontrib><creatorcontrib>Wisoff, P.J.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>OSTI.GOV</collection><jtitle>IEEE journal of quantum electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Phillips, H.</au><au>Kubodera, S.</au><au>Sauerbrey, R.</au><au>Tittel, F.K.</au><au>Wisoff, P.J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics</atitle><jtitle>IEEE journal of quantum electronics</jtitle><stitle>JQE</stitle><date>1991-01</date><risdate>1991</risdate><volume>27</volume><issue>1</issue><spage>95</spage><epage>100</epage><pages>95-100</pages><issn>0018-9197</issn><eissn>1558-1713</eissn><coden>IEJQA7</coden><abstract>Plasmas from a pulsed jet discharge have been characterized with respect to gas species and nozzle design. Spectral lines from the gas used in the pulsed nozzle are apparent in the visible region. The vacuum ultraviolet spectrum, particularly for heavier gases, is dominated by emission from species sputtered from the nozzle. The production of highly ionized and excited states from materials created by the sputtering of the nozzle has possible applications in VUV (vacuum ultraviolet) spectroscopy. Operating the pulsed jet discharge at a 50-Hz repetition rate with NF/sub 3/ to produce excited fluorine ions allowed etch rates in excess of 10 mu m/min to be achieved in silicon; this may have applications to micromechanics.< ></abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/3.73546</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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subjects | 640410 - Fluid Physics- General Fluid Dynamics CHARGED PARTICLES CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY DESIGN ELECTRIC DISCHARGES ELECTROMAGNETIC RADIATION ELEMENTS ENERGY LEVELS Exact sciences and technology EXCITED STATES Fault location FLUIDS FLUORIDES FLUORINE COMPOUNDS FLUORINE IONS FREQUENCY RANGE GASES HALIDES HALOGEN COMPOUNDS HZ RANGE IONS JETS Laser excitation MICROELECTRONICS NITROGEN COMPOUNDS NITROGEN FLUORIDES Noise measurement NOZZLES Orifices Physics Physics of gases, plasmas and electric discharges Physics of plasmas and electric discharges PLASMA Plasma applications PULSES RADIATIONS SEMIMETALS SILICON SPECTROSCOPY Sputter etching SPUTTERING USES VACUUM SYSTEMS Valves VISIBLE RADIATION |
title | Characterization of plasmas from a pulsed jet discharge for applications VUV spectroscopy and micromechanics |
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