Design, modeling, and characterization of FET-SEED smart pixel transceiver arrays for optical backplanes

The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4/spl times/4 transmitter arrays and 4/spl times/4 receiver arrays, packaged at the printed circuit-boar...

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Veröffentlicht in:	IEEE journal of quantum electronics 1996-08, Vol.32 (8), p.1391-1398
Hauptverfasser:	Plant, D.V., Shang, A.Z., Otazo, M.R., Rolston, D.R., Robertson, B., Hinton, H.S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Backplanes Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuit interconnections Optical arrays Optical design Optical receivers Optical transmitters Packaging Printed circuits Smart pixels Transceivers
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Beschreibung
Zusammenfassung:	The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4/spl times/4 transmitter arrays and 4/spl times/4 receiver arrays, packaged at the printed circuit-board level, will be presented. In addition, these results will be compared to device and circuit models developed for these optoelectronics. Finally, the description of the successful application of these optoelectronics to interconnect two printed circuit boards will be described.
ISSN:	0018-9197 1558-1713
DOI:	10.1109/3.511552