The association of component solderability testing with board level soldering performance
The issue being considered is the relationship of visual board-level solder joint quality with both visual dip-and-look solderability assessment and wetting balance measurement of the components prior to board assembly. A description of visual dip-and-loop solderability test assessment along with we...
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Veröffentlicht in: | IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.704-712 |
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creator | Kwoka, M.A. Mullenix, P.D. |
description | The issue being considered is the relationship of visual board-level solder joint quality with both visual dip-and-look solderability assessment and wetting balance measurement of the components prior to board assembly. A description of visual dip-and-loop solderability test assessment along with wetting balance methodology for components is presented. A compendium of wetting balance tests and indexes is documented. The experimental strategy employed is outlined. The experimental technique including the equipment, materials, and component sample preparations is detailed, and experimental results are presented comparing both dip-and-look visual solderability assessment and wetting balance measures to actual board-level soldering performance. The capability of the various assessment methods to predict board-level defects is discussed.< > |
doi_str_mv | 10.1109/33.62583 |
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The capability of the various assessment methods to predict board-level defects is discussed.< ></description><identifier>ISSN: 0148-6411</identifier><identifier>EISSN: 1558-3082</identifier><identifier>DOI: 10.1109/33.62583</identifier><identifier>CODEN: ITTEDR</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aging ; Assembly ; Defense industry ; Electronic components ; Electronic equipment testing ; Inspection ; Lead ; Materials testing ; Military standards ; Soldering</subject><ispartof>IEEE transactions on components, hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.704-712</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c204t-1c370941e82bb0d0ce9c510df5ebed5ea7f67fc8462f83310572d42c88b2df083</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/62583$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/62583$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kwoka, M.A.</creatorcontrib><creatorcontrib>Mullenix, P.D.</creatorcontrib><title>The association of component solderability testing with board level soldering performance</title><title>IEEE transactions on components, hybrids, and manufacturing technology</title><addtitle>T-CHMT</addtitle><description>The issue being considered is the relationship of visual board-level solder joint quality with both visual dip-and-look solderability assessment and wetting balance measurement of the components prior to board assembly. 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The capability of the various assessment methods to predict board-level defects is discussed.< ></description><subject>Aging</subject><subject>Assembly</subject><subject>Defense industry</subject><subject>Electronic components</subject><subject>Electronic equipment testing</subject><subject>Inspection</subject><subject>Lead</subject><subject>Materials testing</subject><subject>Military standards</subject><subject>Soldering</subject><issn>0148-6411</issn><issn>1558-3082</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1990</creationdate><recordtype>article</recordtype><recordid>eNo9kD1PwzAURS0EEqEgsbJ5ZEl5tuPEGVHFl1SJpQxMkWM_U6MkrmwL1H8PJRXTHc7RHQ4h1wyWjEF7J8Sy5lKJE1IwKVUpQPFTUgCrVFlXjJ2Ti5Q-AThvayjI-2aLVKcUjNfZh4kGR00Yd2HCKdMUBotR937weU8zpuynD_rt85b2QUdLB_zC4agd0A6jC3HUk8FLcub0kPDquAvy9viwWT2X69enl9X9ujQcqlwyIxpoK4aK9z1YMNgaycA6iT1aibpxdeOMqmrulBAMZMNtxY1SPbcOlFiQ2_nXxJBSRNftoh913HcMukOSTojuL8mvejOrHhH_tZn9ADpYXV4</recordid><startdate>19901201</startdate><enddate>19901201</enddate><creator>Kwoka, M.A.</creator><creator>Mullenix, P.D.</creator><general>IEEE</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19901201</creationdate><title>The association of component solderability testing with board level soldering performance</title><author>Kwoka, M.A. ; Mullenix, P.D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c204t-1c370941e82bb0d0ce9c510df5ebed5ea7f67fc8462f83310572d42c88b2df083</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1990</creationdate><topic>Aging</topic><topic>Assembly</topic><topic>Defense industry</topic><topic>Electronic components</topic><topic>Electronic equipment testing</topic><topic>Inspection</topic><topic>Lead</topic><topic>Materials testing</topic><topic>Military standards</topic><topic>Soldering</topic><toplevel>online_resources</toplevel><creatorcontrib>Kwoka, M.A.</creatorcontrib><creatorcontrib>Mullenix, P.D.</creatorcontrib><collection>CrossRef</collection><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kwoka, M.A.</au><au>Mullenix, P.D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The association of component solderability testing with board level soldering performance</atitle><jtitle>IEEE transactions on components, hybrids, and manufacturing technology</jtitle><stitle>T-CHMT</stitle><date>1990-12-01</date><risdate>1990</risdate><volume>13</volume><issue>4</issue><spage>704</spage><epage>712</epage><pages>704-712</pages><issn>0148-6411</issn><eissn>1558-3082</eissn><coden>ITTEDR</coden><abstract>The issue being considered is the relationship of visual board-level solder joint quality with both visual dip-and-look solderability assessment and wetting balance measurement of the components prior to board assembly. A description of visual dip-and-loop solderability test assessment along with wetting balance methodology for components is presented. A compendium of wetting balance tests and indexes is documented. The experimental strategy employed is outlined. The experimental technique including the equipment, materials, and component sample preparations is detailed, and experimental results are presented comparing both dip-and-look visual solderability assessment and wetting balance measures to actual board-level soldering performance. The capability of the various assessment methods to predict board-level defects is discussed.< ></abstract><pub>IEEE</pub><doi>10.1109/33.62583</doi><tpages>9</tpages></addata></record> |
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source | IEEE Electronic Library (IEL) |
subjects | Aging Assembly Defense industry Electronic components Electronic equipment testing Inspection Lead Materials testing Military standards Soldering |
title | The association of component solderability testing with board level soldering performance |
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