The association of component solderability testing with board level soldering performance

The issue being considered is the relationship of visual board-level solder joint quality with both visual dip-and-look solderability assessment and wetting balance measurement of the components prior to board assembly. A description of visual dip-and-loop solderability test assessment along with wetting balance methodology for components is presented. A compendium of wetting balance tests and indexes is documented. The experimental strategy employed is outlined. The experimental technique including the equipment, materials, and component sample preparations is detailed, and experimental results are presented comparing both dip-and-look visual solderability assessment and wetting balance measures to actual board-level soldering performance. The capability of the various assessment methods to predict board-level defects is discussed.< >