A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages

A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages

A de-embedding technique for on board structures or devices under tests (DUTs) is presented. The key feature of the method is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. The technique also uses the time-domain option of...

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Veröffentlicht in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1993-05, Vol.16 (3), p.300-303
Hauptverfasser: Van Hauwermeiren, L., Botte, M., De Zutter, D.
Format: Artikel
Sprache:eng
Schlagworte:
Acoustic testing
Bandwidth
Circuits
Coaxial components
Impedance
Microstrip
Packaging
Scattering parameters
Semiconductor device measurement
Time domain analysis
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Zusammenfassung:A de-embedding technique for on board structures or devices under tests (DUTs) is presented. The key feature of the method is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. The technique also uses the time-domain option of modern network analyzers. The approach is illustrated by detailed bandwidth measurements for a high pin count package.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.232056