Correlation between channel hot-electron degradation and radiation-induced interface trapping in MOS devices

A correlation between channel hot-carrier induced degradation is conventional-drain NMOSFETS and radiation-induced transconductance (g/sub m/) degradation is described. The device lifetime, tau /sub HE/, was proportional to the 1.5 power D)/sub EFF/, where D/sub EFF/ is the radiation dose when Delta...

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Veröffentlicht in:IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA) 1989-12, Vol.36 (6), p.2140-2146
Hauptverfasser: Palkuti, L.J., Ormond, R.D., Hu, C., Chung, J.
Format: Artikel
Sprache:eng
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Zusammenfassung:A correlation between channel hot-carrier induced degradation is conventional-drain NMOSFETS and radiation-induced transconductance (g/sub m/) degradation is described. The device lifetime, tau /sub HE/, was proportional to the 1.5 power D)/sub EFF/, where D/sub EFF/ is the radiation dose when Delta g/sub m//g/sub m/=0.5. These results indicate that radiation-induced interface trapping is a strong indicator of hot-electron-device lifetime. The proposed radiation test can be applied to devices with both radiation-hard and radiation-soft field oxide. Initial results on lightly-doped-drain (LDD) devices indicate that correlation between hot-electron degradation and radiation-induced interface trapping is strongly dependent on the design of the LDD.< >
ISSN:0018-9499
1558-1578
DOI:10.1109/23.45416