Surface passivation of GaAs MESFETs

The metal semiconductor field effect transistor (MESFET) represents a more realistic test for "passivation" efficacy than conventional capacitor test structures due to its prototypical fabrication process. This paper evaluates Gallium-Arsenide (GaAs) surface passivation films utilizing the...

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Veröffentlicht in:IEEE transactions on electron devices 1997-11, Vol.44 (11), p.1837-1842
Hauptverfasser: Charache, G.W., Akram, S., Maby, E.W., Bhat, I.B.
Format: Artikel
Sprache:eng
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Zusammenfassung:The metal semiconductor field effect transistor (MESFET) represents a more realistic test for "passivation" efficacy than conventional capacitor test structures due to its prototypical fabrication process. This paper evaluates Gallium-Arsenide (GaAs) surface passivation films utilizing the MESFET as a test vehicle. For this study, gate-to-drain leakage current, gate-to-drain breakdown voltage, complex impedance versus frequency, and low-frequency noise measurements are performed on MESFETs with various passivation films. The results indicate that a hydrogen plasma used to "pre-clean" the GaAs surface in conjunction with an in situ plasma-enhanced chemical vapor deposition (PECVD) Si/sub 3/N/sub 4/ passivation film yields the best performance. In contrast, atomic-layer-epitaxial ZnSe demonstrated inferior performance (even in comparison to PECVD Si/sub 3/N/sub 4/ passivation films that did not receive a hydrogen "pre-clean").
ISSN:0018-9383
1557-9646
DOI:10.1109/16.641350