Characterization of PCB plated-through-hole reliability using statistical analysis

Characterization of PCB plated-through-hole reliability using statistical analysis

Various test methods are used to characterize PCB plated-through-hole reliability. One such method is the interconnect stress test. The results from this test are often used to qualify PCB materials and or fabricators. This paper will discuss how certain statistical analysis techniques may be used t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Circuit world 2005-03, Vol.31 (1), p.8-15
1. Verfasser: Tardibuono, Mark J.
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Various test methods are used to characterize PCB plated-through-hole reliability. One such method is the interconnect stress test. The results from this test are often used to qualify PCB materials and or fabricators. This paper will discuss how certain statistical analysis techniques may be used to decipher the results, and predict capabilities of PCB materials and or processes.
ISSN:0305-6120
1758-602X
0305-6120
DOI:10.1108/03056120510553176