Nanoscale dielectric properties of TiO 2 in SiO 2 nanocomposite deposited by hybrid PECVD method

In this paper, nanocomposites (TiO 2 in SiO 2 ) are produced by an advanced hybrid aerosol-PECVD method based on direct liquid injection of a non-commercial colloidal solution in an O 2 / hexamethyldisiloxane (HMDSO) low-pressure plasma. Dielectric properties are investigated at nanoscale using tech...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Nano express 2024-03, Vol.5 (1), p.15010
Hauptverfasser: Villeneuve-Faure, C, Mitronika, M, Dan, A P, Boudou, L, Ravisy, W, Besland, M P, Richard-Plouet, M, Goullet, A
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this paper, nanocomposites (TiO 2 in SiO 2 ) are produced by an advanced hybrid aerosol-PECVD method based on direct liquid injection of a non-commercial colloidal solution in an O 2 / hexamethyldisiloxane (HMDSO) low-pressure plasma. Dielectric properties are investigated at nanoscale using techniques derived from Atomic Force Microcopy in terms of relative dielectric permittivity, charge injection and transport. Results show that a concentration in TiO 2 up to 14% by volume makes it possible to increase the relative dielectric permittivity up to 4.8 while maintaining the insulating properties of the silica matrix. For a TiO 2 concentration in the range 15%–37% by volume, the relative dielectric permittivity increases (up to 11 for 37% TiO 2 by volume) and only few agglomerated nanoparticles lowering the insulating properties are observed. For TiO 2 concentration above 40% by volume, the relative dielectric permittivity still increases but the quantity of agglomerated nanoparticles is very high, which greatly increases the charge transport dynamic and degrades the insulating properties. Finally, 37% of TiO 2 by volume in the SiO 2 matrix appears to be the best compromise, between high dielectric permittivity and low leakage current for the MIM applications aimed.
ISSN:2632-959X
2632-959X
DOI:10.1088/2632-959X/ad220d