Design of lateral β-Ga 2 O 3 MOSFET with PFOM of 769.42 MW cm –2
The Power figure of Merit (PFOM = V br 2 /R on,sp ) is used to evaluate the performance of Gallium Oxide ( β -Ga 2 O 3 ) power devices. In this study, a lateral β -Ga 2 O 3 MOSFET device is designed. The effects of different gate lengths, gate-drain distances, and epitaxial layer doping concentratio...
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Veröffentlicht in: | Engineering Research Express 2024-03, Vol.6 (1), p.15060 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The Power figure of Merit (PFOM = V
br
2
/R
on,sp
) is used to evaluate the performance of Gallium Oxide (
β
-Ga
2
O
3
) power devices. In this study, a lateral
β
-Ga
2
O
3
MOSFET device is designed. The effects of different gate lengths, gate-drain distances, and epitaxial layer doping concentrations on the device performance are investigated. It is found that when the gate length is 3
μ
m, the breakdown voltage of the device is 3099 V, which is approximately twice that of devices with other gate lengths. The PFOM of the device reaches 769.14MW cm
–2
. Furthermore, the breakdownvoltage exhibits a trend of initially decreasing and then increasing with the increase of the gate-drain distance. When the gate-drain distance is 37
μ
m, the breakdown voltage of the device reaches 4367 V. Additionally, it is observed that the device performance is optimal when the epitaxial layer doping concentration is 2 × 10
17
cm
−3
. This study provides a new approach for the design of Gallium Oxide power devices. |
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ISSN: | 2631-8695 2631-8695 |
DOI: | 10.1088/2631-8695/ad1fb5 |