Effects of bonding temperature on the microstructures and mechanical properties of the C/C-Cf/SiC composite joint prepared by in situ hot-press diffusion bonding using Ti-Si-C compound as interlayer

Using Ti-Si-C mixed powder as bonding material, C/C composite was bonded to Cf/SiC composite by in situ hot-press diffusion bonding. Effects of bonding temperature on the microstructures and mechanical properties of the C/C-Cf/SiC composite joint were investigated. The shear test result showed that the joint obtained at 1550 °C for 60 min has the maximum shear strength (11.1 1.1 MPa), in which compacted interlayer, powerful interface joining and 'nail effect' can be responsible for the outstanding mechanical properties of joint. Moreover, the analysis result of shear fracture morphology and fractural behavior displayed that the fracture happens in the interface area of C/C composite/interlayer and extends into the interlayer area, as well as some ductile fractural features present in the C/C-Cf/SiC composite joints.