Systematic oxygen impurity reduction in smooth N-polar GaN by chemical potential control

Process chemical potential control and dislocation reduction were implemented to control oxygen concentration in N-polar GaN layers grown on sapphire substrates via metal organic chemical vapor deposition (MOCVD). As process supersaturation was changed from ∼30 to 3400, the formation energy of the o...

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Veröffentlicht in:Semiconductor science and technology 2022-01, Vol.37 (1), p.15005
Hauptverfasser: Szymanski, Dennis, Wang, Ke, Kaess, Felix, Kirste, Ronny, Mita, Seiji, Reddy, Pramod, Sitar, Zlatko, Collazo, Ramon
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Sprache:eng
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Zusammenfassung:Process chemical potential control and dislocation reduction were implemented to control oxygen concentration in N-polar GaN layers grown on sapphire substrates via metal organic chemical vapor deposition (MOCVD). As process supersaturation was changed from ∼30 to 3400, the formation energy of the oxygen point defect increased, which resulted in a 25-fold decrease in oxygen incorporation. Reducing dislocations by approximately a factor of 4 (to ∼10 9 cm −3 ) allowed for further reduction of oxygen incorporation to the low-10 17 cm −3 range. Smooth N-polar GaN layers with low oxygen content were achieved by a two-step process, whereas first a 1 µ m thick smooth N-polar layer with high oxygen concentration was grown, followed by low oxygen concentration layer grown at high supersaturation.
ISSN:0268-1242
1361-6641
DOI:10.1088/1361-6641/ac3638