Obtaining impact ionization-induced hole current by electrical measurements in gallium nitride metal–insulator–semiconductor high electron mobility transistors

In this paper, an extraction method for measuring impact ionization-induced hole current in gallium nitride (GaN) metal–insulator–semiconductor high electron mobility transistors (MIS-HEMTs) is proposed. The results show that the non-monotonic impact ionization current characteristic can be easily a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of physics. D, Applied physics Applied physics, 2021-07, Vol.54 (28), p.285104
Hauptverfasser: Yeh, Yu-Hsuan, Chang, Ting-Chang, Huang, Wei-Chen, Zheng, Hao-Xuan, Tsao, Yu-Ching, Ciou, Fong-Min, Lin, Yu-Shan, Tan, Yung-Fang, Sun, Li-Chuan, Zhou, Kuan-Ju, Chen, Kuan-Hsu, Huang, Jen-Wei
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this paper, an extraction method for measuring impact ionization-induced hole current in gallium nitride (GaN) metal–insulator–semiconductor high electron mobility transistors (MIS-HEMTs) is proposed. The results show that the non-monotonic impact ionization current characteristic can be easily acquired by the extraction method. Further, different hot-carrier stress (HCS) conditions can be obtained based on the I G – V G curve, and the reliability tests can act as verification of the impact-ionization curve. In addition, electrical reliability tests indicate that the threshold voltage ( V TH ) shift and on-state current ( I on ) degradation in the MIS-HEMTs have a positive correlation to impact ionization-generated hole current. During HCS operation, the V TH will shift positively and I on decreases due to hot electrons trapping into the GaN layer. This model is validated by TCAD simulation.
ISSN:0022-3727
1361-6463
DOI:10.1088/1361-6463/abfad5