An experimental study on flow friction and heat transfer of water in sinusoidal wavy silicon microchannels

Sinusoidal wavy microchannels have been known as a more heat transfer efficient heat sink for the cooling of electronics than normal straight microchannels. However, the existing experimental study on wavy silicon microchannels with different phase differences are few. As a result of this, in this paper an experimental study has been conducted to investigate the single phase flow friction and heat transfer of de-ionized water in eight different sinusoidal wavy silicon microchannels (SWSMCs) and one straight silicon microchannel (SMC). The SWSMCs feature different phase differences (α = 0 to π) and different relative wavy amplitudes (β = A/l = 0.05 to 0.4), but the same average hydraulic diameters (Dh = 160 µm). It is found that both flow friction constant fRe and the Nusselt number depend on the phase difference and relative wavy amplitude. For sinusoidal wavy microchannels with a relative wavy amplitude (β = 0.05), the Nusselt number increased noticeably with the phase difference for Re > 250, but the effect was insignificant for Re 300. The results indicate that the thermal resistances of sinusoidal wavy silicon microchannels were generally lower than that of straight silicon microchannels, and the thermal resistance decreased with the increase in relative wavy amplitude. The enhancement of thermal performance is attributed to the flow re-circulation occurring in the corrugation troughs and the secondary flows or Dean vortices introduced by curved channels. It is concluded that silicon sinusoidal wavy microchannels provide higher heat transfer rate albeit with a higher flow friction, making it a better choice for the cooling of high heat flux electronics.