High current density and low emission field of carbon nanotube array microbundle

Field electron emission from carbon nanotubes shows promising application potential in devices. Low adhesive bonding strength between the carbon nanotubes and the substrate presents a practical challenge in environments such as high field emission current density. In this paper, we report on the performance of a carbon nanotube microbundle attached to a tungsten needle by a uniform glue layer. The device is easily fabricated without complex fixture and possesses a complete array structure. After curing the glue in air, the adhesive strength between the carbon nanotubes and the needle is over 2000 N/cm2. Field emission measurements demonstrate that the maximum current density of the emitters is over 20 A/cm2 under a low applied field (