Germanium oxynitride gate interlayer dielectric formed on Ge(100) using decoupled plasma nitridation

Germanium Oxynitride (GeON) gate interlayer (IL) dielectric formed using decoupled plasma nitridation (DPN) technique is compared with GeO2 and thermally nitrided GeON ILs for Ge gate stack applications using n-channel capacitors and transistors. Lower nitrogen concentration and roughness at the GeON/Ge interface lead to lower midgap interface trap density (Dit) and 1.5× higher electron mobility for the DPN versus thermally nitrided GeON IL. DPN GeON IL also exhibits enhanced thermal stability till 575 °C at the expense of a small degradation in Dit versus GeO2 IL, making it a more viable gate IL dielectric on Ge channels.