Competitive device performance of low-temperature and all-solution-processed metal-oxide thin-film transistors

In this Letter, we described a solution-processed indium-gallium-zinc oxide thin-film transistors (TFTs) with a solution-processed aluminum oxide phosphate gate dielectric, fabricated at a maximum annealing temperature under 350°C to be applicable to conventional fabrication process of flat-panel di...

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Veröffentlicht in:Applied physics letters 2011-12, Vol.99 (24), p.242109-242109-3
Hauptverfasser: Kim, Kyung Min, Kim, Chi Wan, Heo, Jae-Seok, Na, Hyungil, Lee, Jung Eun, Park, Chang Bum, Bae, Jong-Uk, Kim, Chang-Dong, Jun, Myungchul, Hwang, Yong Kee, Meyers, Stephen T., Grenville, Andrew, Keszler, Douglas A.
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Sprache:eng
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Zusammenfassung:In this Letter, we described a solution-processed indium-gallium-zinc oxide thin-film transistors (TFTs) with a solution-processed aluminum oxide phosphate gate dielectric, fabricated at a maximum annealing temperature under 350°C to be applicable to conventional fabrication process of flat-panel displays (FPDs). The solution-processed TFTs exhibited competitive device characteristics under 350°C, including a field-effect mobility of 4.50cm 2 /Vs, an on-to-off current ratio of ∼10 9 , a threshold voltage of 2.34V, and a subthreshold gate swing of 0.46V/dec, making them applicable to the future backplane of FPDs.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.3665912