Flip chip lamination to electrically contact organic single crystals on flexible substrates
The fabrication of top metal contacts for organic devices represents a challenge and has important consequences for electrical properties of such systems. We report a robust, low-cost and nondestructive printing process, flip chip lamination, to fabricate top contacts on rubrene single crystals. The...
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Veröffentlicht in: | Applied physics letters 2011-04, Vol.98 (16), p.163302-163302-3 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The fabrication of top metal contacts for organic devices represents a challenge and has important consequences for electrical properties of such systems. We report a robust, low-cost and nondestructive printing process, flip chip lamination, to fabricate top contacts on rubrene single crystals. The use of surface chemistry treatments with fluorinated self-assembled monolayers, combined with pliable substrates, and mild nanoimprint conditions, ensures conformal contact between ultrasmooth metal contacts and the organic crystal. Space-charge limited current measurements point to better interfacial electrical properties with the flip chip lamination-fabricated contacts compared to the analog architecture of e-beam evaporated top contacts. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.3580610 |