Polishing of YBa2Cu3O7-y by He-ion etching

Clean polishing is performed by helium-ion etching on a surface of high-Tc YBa2Cu3O7−y. Based on a knock-on cascade model, the decrease of surface roughness is discussed. A rate process of etching is applied for the surface roughness of the high-Tc YBa2Cu3O7−y.

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Veröffentlicht in:Journal of applied physics 1992, Vol.71 (1), p.347-349
Hauptverfasser: INOUE, N, TAKAHASHI, Y, SUDO, T, SAKAMOTO, K, SHIMA, T, NISHI, Y
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container_title Journal of applied physics
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creator INOUE, N
TAKAHASHI, Y
SUDO, T
SAKAMOTO, K
SHIMA, T
NISHI, Y
description Clean polishing is performed by helium-ion etching on a surface of high-Tc YBa2Cu3O7−y. Based on a knock-on cascade model, the decrease of surface roughness is discussed. A rate process of etching is applied for the surface roughness of the high-Tc YBa2Cu3O7−y.
doi_str_mv 10.1063/1.350713
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subjects Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Physics
Solid surfaces and solid-solid interfaces
Surface structure and topography
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
title Polishing of YBa2Cu3O7-y by He-ion etching
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