Polishing of YBa2Cu3O7-y by He-ion etching

Clean polishing is performed by helium-ion etching on a surface of high-Tc YBa2Cu3O7−y. Based on a knock-on cascade model, the decrease of surface roughness is discussed. A rate process of etching is applied for the surface roughness of the high-Tc YBa2Cu3O7−y.

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Veröffentlicht in:Journal of applied physics 1992, Vol.71 (1), p.347-349
Hauptverfasser: INOUE, N, TAKAHASHI, Y, SUDO, T, SAKAMOTO, K, SHIMA, T, NISHI, Y
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Sprache:eng
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Zusammenfassung:Clean polishing is performed by helium-ion etching on a surface of high-Tc YBa2Cu3O7−y. Based on a knock-on cascade model, the decrease of surface roughness is discussed. A rate process of etching is applied for the surface roughness of the high-Tc YBa2Cu3O7−y.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.350713