Diffusion of tellurium dopant in silicon

The diffusion of tellurium in silicon has been investigated by means of secondary ion mass spectrometry. In the temperature interval between 900 and 1250 °C the diffusion coefficient has been found to range from ∼2×10−15 to 6×10−12 cm2/s, i.e., several orders of magnitude lower than the diffusion co...

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Veröffentlicht in:Journal of applied physics 1982-01, Vol.53 (11), p.7367-7371
Hauptverfasser: Janzén, E., Grimmeiss, H. G., Lodding, A., Deline, Ch
Format: Artikel
Sprache:eng
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Zusammenfassung:The diffusion of tellurium in silicon has been investigated by means of secondary ion mass spectrometry. In the temperature interval between 900 and 1250 °C the diffusion coefficient has been found to range from ∼2×10−15 to 6×10−12 cm2/s, i.e., several orders of magnitude lower than the diffusion coefficients of the other chalcogens S and Se. In units of cm2/s and eV, the results may be expressed as DTe=0.50 exp(−3.34/kT), suggestive of a predominantly substitutional mechanism of diffusion.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.330104