Blue light-emitting diodes with a roughened backside fabricated by wet etching
The InGaN-based light-emitting diodes (LEDs) with a roughened patterned backside on the N-face GaN surface were fabricated through a crystallographic etching process to increase light-extraction efficiency. After laser decomposition, laser scribing, and a lateral crystallographic wet etching process...
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Veröffentlicht in: | Applied physics letters 2009-11, Vol.95 (20) |
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Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The InGaN-based light-emitting diodes (LEDs) with a roughened patterned backside on the N-face GaN surface were fabricated through a crystallographic etching process to increase light-extraction efficiency. After laser decomposition, laser scribing, and a lateral crystallographic wet etching process at the GaN/Al2O3 interface, stable crystallographic etching planes were formed as the GaN {1011¯} planes that included an angle with the top GaN (0001) plane measured at 58°. The GaN buffer layer acted as the sacrificial layer for the laser decomposition process and the lateral wet etching process with a 26 μm/min etching rate. The LED with the inverted pyramidal N-face GaN surface close to the GaN/Al2O3 interface has a larger light-scattering process than the conventional LED. The light-output power of the LED with the backside roughened surface had a 47% enhancement when measured in LED chip form. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.3262968 |