Origin of forward leakage current in GaN-based light-emitting devices

The authors fabricated GaN-based light-emitting diodes (LEDs) on two different GaN templates with the same LED structure. One on thin GaN template ( ∼ 2 μ m ) with high dislocation density [low ( 10 9 cm − 2 ) ] grown by metal-organic vapor-phase epitaxy (sample A) and the other on thick GaN templat...

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Veröffentlicht in:Applied physics letters 2006-09, Vol.89 (13), p.132117-132117-3
Hauptverfasser: Lee, S. W., Oh, D. C., Goto, H., Ha, J. S., Lee, H. J., Hanada, T., Cho, M. W., Yao, T., Hong, S. K., Lee, H. Y., Cho, S. R., Choi, J. W., Choi, J. H., Jang, J. H., Shin, J. E., Lee, J. S.
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Sprache:eng
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Zusammenfassung:The authors fabricated GaN-based light-emitting diodes (LEDs) on two different GaN templates with the same LED structure. One on thin GaN template ( ∼ 2 μ m ) with high dislocation density [low ( 10 9 cm − 2 ) ] grown by metal-organic vapor-phase epitaxy (sample A) and the other on thick GaN template ( ∼ 20 μ m ) with comparatively low dislocation density [high ( 10 8 cm − 2 ) ] by hydride vapor-phase epitaxy (sample B). In order to understand the mechanism of leakage current in LEDs, the correlation between current-voltage characteristics and etch pit density of LEDs was studied.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.2357930