Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps
We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of 10 kA ∕ cm 2 was used to increase the operation speed of a pulse driver and receiver. The chip...
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| Veröffentlicht in: | Applied physics letters 2005-07, Vol.87 (2), p.022502-022502-3 |
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| container_title | Applied physics letters |
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| creator | Hashimoto, Yoshihito Yorozu, Shinichi Satoh, Tetsuro Miyazaki, Toshiyuki |
| description | We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of
10
kA
∕
cm
2
was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of
30
μ
m
. With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than
10
−
15
. The power dissipated by the driver and receiver was only
0.24
μ
W
at 117 Gbps. |
| doi_str_mv | 10.1063/1.1993767 |
| format | Article |
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10
kA
∕
cm
2
was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of
30
μ
m
. With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than
10
−
15
. The power dissipated by the driver and receiver was only
0.24
μ
W
at 117 Gbps.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/1.1993767</identifier><identifier>CODEN: APPLAB</identifier><language>eng</language><publisher>American Institute of Physics</publisher><ispartof>Applied physics letters, 2005-07, Vol.87 (2), p.022502-022502-3</ispartof><rights>2005 American Institute of Physics</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c350t-da05642e6e159ba27269544a124d7edc4d6cd7a7f472d61f2f9e2fabf24c663f3</citedby><cites>FETCH-LOGICAL-c350t-da05642e6e159ba27269544a124d7edc4d6cd7a7f472d61f2f9e2fabf24c663f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/apl/article-lookup/doi/10.1063/1.1993767$$EHTML$$P50$$Gscitation$$H</linktohtml><link.rule.ids>314,776,780,790,1553,4498,27901,27902,76127,76133</link.rule.ids></links><search><creatorcontrib>Hashimoto, Yoshihito</creatorcontrib><creatorcontrib>Yorozu, Shinichi</creatorcontrib><creatorcontrib>Satoh, Tetsuro</creatorcontrib><creatorcontrib>Miyazaki, Toshiyuki</creatorcontrib><title>Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps</title><title>Applied physics letters</title><description>We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of
10
kA
∕
cm
2
was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of
30
μ
m
. With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than
10
−
15
. The power dissipated by the driver and receiver was only
0.24
μ
W
at 117 Gbps.</description><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNp1kD1PwzAQhi0EEqUw8A-8Mrj4bMcmCxIqUJAqscBsOf5Ig5o4xI5E_z0p7cLA9OruHp3uHoSugS6ASn4LCyhLrqQ6QTOgShEOcHeKZpRSTmRZwDm6SOlzKgvG-QzVj76NXcqDyU3scAzYbpqe5Ej2iad-l9ompeMwNV299SRsx2_yNZoujy3ux23yCZuM82aIY73px5xw5XexcxgoxauqT5foLJiJuzrmHH08P70vX8j6bfW6fFgTywuaiTO0kIJ56aEoK8MUm24WwgATTnlnhZPWKaOCUMxJCCyUngVTBSaslDzwObo57LVDTGnwQfdD05php4HqvSEN-mhoYu8PbLJN_v3_f_iPJh2DnvTwH7JVb9o</recordid><startdate>20050711</startdate><enddate>20050711</enddate><creator>Hashimoto, Yoshihito</creator><creator>Yorozu, Shinichi</creator><creator>Satoh, Tetsuro</creator><creator>Miyazaki, Toshiyuki</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20050711</creationdate><title>Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps</title><author>Hashimoto, Yoshihito ; Yorozu, Shinichi ; Satoh, Tetsuro ; Miyazaki, Toshiyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c350t-da05642e6e159ba27269544a124d7edc4d6cd7a7f472d61f2f9e2fabf24c663f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hashimoto, Yoshihito</creatorcontrib><creatorcontrib>Yorozu, Shinichi</creatorcontrib><creatorcontrib>Satoh, Tetsuro</creatorcontrib><creatorcontrib>Miyazaki, Toshiyuki</creatorcontrib><collection>CrossRef</collection><jtitle>Applied physics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hashimoto, Yoshihito</au><au>Yorozu, Shinichi</au><au>Satoh, Tetsuro</au><au>Miyazaki, Toshiyuki</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps</atitle><jtitle>Applied physics letters</jtitle><date>2005-07-11</date><risdate>2005</risdate><volume>87</volume><issue>2</issue><spage>022502</spage><epage>022502-3</epage><pages>022502-022502-3</pages><issn>0003-6951</issn><eissn>1077-3118</eissn><coden>APPLAB</coden><abstract>We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of
10
kA
∕
cm
2
was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of
30
μ
m
. With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than
10
−
15
. The power dissipated by the driver and receiver was only
0.24
μ
W
at 117 Gbps.</abstract><pub>American Institute of Physics</pub><doi>10.1063/1.1993767</doi></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0003-6951 |
| ispartof | Applied physics letters, 2005-07, Vol.87 (2), p.022502-022502-3 |
| issn | 0003-6951 1077-3118 |
| language | eng |
| recordid | cdi_crossref_primary_10_1063_1_1993767 |
| source | AIP Journals Complete; AIP Digital Archive |
| title | Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps |
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