Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps

We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of 10 kA ∕ cm 2 was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of 30 μ m . With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than 10 − 15 . The power dissipated by the driver and receiver was only 0.24 μ W at 117 Gbps.