Electron mobility in Ge and strained- Si channel ultrathin-body metal-oxide semi conductor field-effect transistors
Electron mobility in strained silicon and various surface oriented germanium ultrathin-body (UTB) metal-oxide semiconductor field-effect transistors (MOSFETs) with sub- 10 - nm -body thickness are systematically studied. For biaxial tensile strained- Si UTB MOSFETs, strain effects offer mobility enh...
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Veröffentlicht in: | Applied physics letters 2004-09, Vol.85 (12), p.2402-2404 |
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Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | Electron mobility in strained silicon and various surface oriented germanium ultrathin-body (UTB) metal-oxide semiconductor field-effect transistors (MOSFETs) with sub-
10
-
nm
-body thickness are systematically studied. For biaxial tensile strained-
Si
UTB MOSFETs, strain effects offer mobility enhancement down to a body thickness of
3
nm
, below which strong quantum confinement effect renders further valley splitting via application of strain redundant. For
Ge
channel UTB MOSFETs, electron mobility is found to be highly dependent on surface orientation.
Ge
⟨
100
⟩
and
Ge
⟨
110
⟩
surfaces have low quantization mass that leads to a lower mobility than that of
Si
in aggressively scaled UTB MOSFETs. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.1788888 |