Influence of in situ applied stress during thermal oxidation of (111)Si on Pb interface defects

The results of a series of experiments are reported in which constant, controlled levels of in-plane stress were applied in situ to oxidizing (111) silicon substrates. Electron spin resonance measurements show that the properties of inherently incorporated electrically active Pb defects at the (111)Si/SiO2 interface are affected; among others, tensile stresses decrease the number of Pbs, while compressive stresses have the opposite effect. The results are in agreement with the generally accepted relationship between Pb-defect generation and interfacial mismatch (stress).