Phosphorus and arsenic penetration studies through HfSixOy and HfSixOyNz films

Phosphorus and arsenic penetration studies from P- and As-doped polycrystalline silicon through HfSixOy and HfSixOyNz (18% N) alternate gate dielectric candidates films into Si(100) are presented using a combination of chemical etching and secondary ion mass spectrometry (SIMS). Penetration is observed through HfSixOy after 1050 and 1000 °C rapid thermal annealing for As and P, respectively. In contrast, As or P dopant penetration is at the SIMS limit of detection for HfSixOyNz films. By modeling the P and As depth profiles in the Si substrate, their respective diffusivities in HfSixOy are higher than the corresponding diffusivities in SiO2. The enhanced dopant diffusivity observed in HfSixOy is proposed to be due to grain boundary formation in the dielectric after crystallization from annealing.