Formation of cobalt silicide spikes in 0.18 μm complementary metal oxide semiconductor process

Co silicide spikes have been found in active contact salicidation in complementary metal oxide semiconductor devices during failure analysis by means of transmission electron microscopy examination. Scanning transmission electron microscopy, energy dispersive x-ray analysis and microdiffraction stud...

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Veröffentlicht in:Applied physics letters 2001-05, Vol.78 (20), p.3091-3093
Hauptverfasser: Dai, J. Y., Guo, Z. R., Tee, S. F., Tay, C. L., Er, Eddie, Redkar, S.
Format: Artikel
Sprache:eng
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Zusammenfassung:Co silicide spikes have been found in active contact salicidation in complementary metal oxide semiconductor devices during failure analysis by means of transmission electron microscopy examination. Scanning transmission electron microscopy, energy dispersive x-ray analysis and microdiffraction study revealed that these spikes are CoSi2 with an epitaxial relationship with Si of (111)CoSi2//(111)Si and [11̄0]CoSi2//[11̄0]Si. The formation of the CoSi2 spikes are suspected to be due to the presence of undesired SiOx residue between Co film and Si substrate which acts as a solid diffusion membrane to cause the Si rich phase CoSi2 to precipitate directly inside Si lattice.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.1372621