Microstructure and deposition rate of aluminum thin films from chemical vapor deposition with dimethylethylamine alane

Deposition of aluminum film from DMEAA in the temperature range of 100–300 °C has been studied. In this temperature range, there is a maximum deposition rate at around 150 °C. The film deposited at 190 °C has elongated blocklike grain shapes, which are ∼600 nm in width and 930 nm in length. Grains i...

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Veröffentlicht in:Applied physics letters 1996-06, Vol.68 (25), p.3567-3569
Hauptverfasser: Kim, Byoung-Youp, Li, Xiaodong, Rhee, Shi-Woo
Format: Artikel
Sprache:eng
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Zusammenfassung:Deposition of aluminum film from DMEAA in the temperature range of 100–300 °C has been studied. In this temperature range, there is a maximum deposition rate at around 150 °C. The film deposited at 190 °C has elongated blocklike grain shapes, which are ∼600 nm in width and 930 nm in length. Grains in the film deposited at 150 °C showed an equiaxed structure with grain size in the range of 100–300 nm in a film with 600 nm thickness. Aluminum oxide particle inclusion was observed especially at high deposition temperature. Plausible reaction pathways of DMEAA dissociation were suggested to explain the experimental observations.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.116639