Low-temperature homoepitaxial growth of Si by electron cyclotron resonance plasma enhanced chemical vapor deposition

Epitaxial Si films have been deposited at low substrate temperatures of 400 and 500 °C, by plasma enhanced chemical vapor deposition using an electron cyclotron resonance source. Samples were analyzed using Rutherford backscatter spectrometry, cross-sectional transmission electron microscopy, and x-ray diffraction. The ion-to-adatom arrival ratio was found to be an important parameter in determining epitaxial film quality. This ratio was controlled by the SiH4 feed rate, microwave power level, and shape of the magnetic field in the substrate region. Incident ion energy and ion flux were monitored with a gridded energy analyzer located at the substrate location.