High-resolution transmission electron microscopy study of 1.5 nm ultrathin tunnel oxides of metal-nitride-oxide-silicon nonvolatile memory devices

Metal-nitride-oxide-silicon (MNOS) nonvolatile memory devices have an ultrathin tunnel oxide SiO2 layer and a signal-charge-stored nitride Si3N4 layer. Using high-resolution transmission electron microscopy (TEM), the cross-sectional structure of MNOS devices has been observed for the first time, including direct observation of tunnel SiO2. The following is revealed: (1) Tunnel SiO2 of 1.5 nm thickness is fabricated very uniformly on the surface of a Si substrate. (2) No mixing of tunnel SiO2 and Si3N4 is observed even though tunnel SiO2 is extremely thin. As a result, we can suggest that tunnel SiO2 in a MNOS device exhibits very stable morphology and stoichiometry characteristics.