Correlation between the formation of particle defects on sputtered Cu seed layers and Cu targets

For advanced copper (Cu) interconnection applications, this work investigated the influence of impurity particles in the Cu target on the formation of particle defects on the sputtered Cu film. By using a liquid particle counter detection system and X-ray photoelectron spectroscopy, the properties o...

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Veröffentlicht in:	Micro & nano letters 2019-09, Vol.14 (10), p.1079-1082
Hauptverfasser:	Bian, Yi-Jun, Cha, Ming-Yang, Chen, Lin, Sun, Qing-Qing, Zhang, Wei, Ding, Shi-Jin
Format:	Artikel
Sprache:	eng
Schlagworte:	advanced copper interconnection applications Carbon carbon particle number Copper Defects Impurities impurity particles liquid particle counter detection system metallic thin films particle defects Photoelectrons Radiation counters semiconductor device metallisation sputter deposition sputtered Cu seed layers X‐ray photoelectron spectra X‐ray photoelectron spectroscopy
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