Athermal silicon optical interposers with quantum dot lasers operating from 25 to 125°C

Interposers for inter-chip interconnects should perform stably under high-temperature conditions and rapid temperature change due to the heat generated by mounted large-scale integration (LSI) chips. Athermal silicon optical interposers integrated with quantum dot lasers and other temperature-insens...

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Veröffentlicht in:Electronics letters 2014-09, Vol.50 (19), p.1377-1378
Hauptverfasser: Urino, Y, Hatori, N, Akagawa, T, Shimizu, T, Okano, M, Ishizaka, M, Yamamoto, T, Okayama, H, Onawa, Y, Takahashi, H, Shimura, D, Yaegashi, H, Nishi, H, Fukuda, H, Yamada, K, Miura, M, Fujikata, J, Akiyama, S, Baba, T, Usuki, T, Noguchi, Y, Noguchi, M, Imai, M, Hirayama, N, Saitou, S, Yamagishi, M, Takahashi, M, Saito, E, Okamoto, D, Mori, M, Horikawa, T, Nakamura, T, Arakawa, Y
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Sprache:eng
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Zusammenfassung:Interposers for inter-chip interconnects should perform stably under high-temperature conditions and rapid temperature change due to the heat generated by mounted large-scale integration (LSI) chips. Athermal silicon optical interposers integrated with quantum dot lasers and other temperature-insensitive components on a single silicon substrate are demonstrated, and error-free data links at 12.5 Gbit/s operating from 25 to 125°C are achieved without any bias adjustment. Since maximum junction temperatures in most LSIs have been below 125°C now and will be in the future, the interposers are tolerant of heat generated by LSIs, and are suitable for inter-chip interconnects.
ISSN:0013-5194
1350-911X
1350-911X
DOI:10.1049/el.2014.2135