Developments, challenges and future trends in advanced sustainable machining technologies for preparing array micro-holes

The use of array micro-holes is becoming increasingly prevalent across a range of industries, including the aerospace, automotive, electronics, medical and chemical industries. The utilization of advanced sustainable machining technologies offers distinctive advantages and is pivotal for the sustain...

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Veröffentlicht in:Nanoscale 2024-11, Vol.16 (43), p.19938-19969
Hauptverfasser: Liu, Yang, Ouyang, Pengfei, Zhang, Zhaoyang, Zhu, Hao, Chen, Xiaolei, Wang, Yufeng, Li, Benkai, Xu, Kun, Wang, Jingtao, Lu, Jinzhong
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Sprache:eng
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Zusammenfassung:The use of array micro-holes is becoming increasingly prevalent across a range of industries, including the aerospace, automotive, electronics, medical and chemical industries. The utilization of advanced sustainable machining technologies offers distinctive advantages and is pivotal for the sustainable manufacture of array micro-holes. This paper examines the sustainable machining techniques commonly employed in the production of array micro-holes, including electrical discharge machining, laser machining, electrochemical machining and composite machining technologies. The paper begins with an elaboration of the processing principles and characteristics of multiple non-traditional machining techniques. The performance indicators of the most commonly used processing technologies in industrial production are summarized from seven perspectives. Six significant avenues for the advancement of sustainable manufacturing technology for array micro-holes have been identified and categorized. This article provides a summary and evaluation of the previous relevant literature, with the aim of offering guidance for the development of array micro-hole processing technologies. The use of array micro-holes is becoming increasingly prevalent across a range of industries, including the aerospace, automotive, electronics, medical and chemical industries.
ISSN:2040-3364
2040-3372
2040-3372
DOI:10.1039/d4nr02910k