A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic material

A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resin counterparts, the cured DCPD-based resin demonstrates excellent thermal properties ( T g > 250 °C) and a low dissipation factor (0.0065 at 10 GHz), ind...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Chemical communications (Cambridge, England) England), 2024-12, Vol.61 (2), p.35-353
Hauptverfasser:	Li, Yuqing, Zhao, Peng, Ju, Xiongtao, Jiang, Shutong, Zhang, Long, Li, Jianhua, Li, Shun, Li, Xu, Zhang, Jianming
Format:	Artikel
Sprache:	eng
Schlagworte:	Bisphenol A Dissipation factor Electronic materials Epoxy resins Thermodynamic properties
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resin counterparts, the cured DCPD-based resin demonstrates excellent thermal properties ( T g > 250 °C) and a low dissipation factor (0.0065 at 10 GHz), indicating its potential as a promising thermoset for high-performance electronic applications. A fully polydicyclopentadiene-networked epoxy resin demonstrates outstanding properties with a high T g of over 250 °C and a low D k of 0.0065 at 10 GHz as an electronic material, outperforming commercial DGEBA epoxy resins.
ISSN:	1359-7345 1364-548X 1364-548X
DOI:	10.1039/d4cc05871b