Enhanced interactions of excitonic complexes in free-standing WS 2

Excitonic complexes, bound states of electrons and holes, provide a promising platform in monolayer transition-metal dichalcogenide (TMDC) semiconductors for investigating diverse many-body interaction phenomena. The surrounding dielectric environment has been found to strongly influence the exciton...

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Veröffentlicht in:Nanoscale 2023-12, Vol.15 (48), p.19533-19545
Hauptverfasser: Sun, Xueqian, Lu, Zhuoyuan, Lu, Yuerui
Format: Artikel
Sprache:eng
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Zusammenfassung:Excitonic complexes, bound states of electrons and holes, provide a promising platform in monolayer transition-metal dichalcogenide (TMDC) semiconductors for investigating diverse many-body interaction phenomena. The surrounding dielectric environment has been found to strongly influence the excitonic properties of the TMDC monolayers. While the impact of different dielectric surroundings on two-dimensional semiconductor materials and their strong correlations have been well studied, the effects on exciton formation and its properties resulting from a further reduction in dielectric screening remain elusive. In this study, we examined free-standing tungsten disulfide (WS ) monolayers, where the efficient generation of higher-order correlated excitonic complexes is readily observed. This phenomenon arises from the effective mutual interactions among excitons and internal carriers, attributed to the modulated exciton dynamics generated by the further reduced dielectric screening effect in the freestanding structure. The formation efficiency of excitonic complexes is enhanced and the multiple biexciton species (five particles such as charged biexcitons and acceptor/donor-bound biexcitons) are successfully induced under low excitation intensity and moderate temperature conditions. Our findings offer valuable insights into the influence of the dielectric environment on exciton interactions and enable a productive avenue for exploring fundamental many-body interactions, providing new possibilities for dielectric engineering of atomic thin semiconductors.
ISSN:2040-3364
2040-3372
DOI:10.1039/D3NR04594C