A novel broken-gap chemical-bonded SiC/Ti 2 CO 2 heterojunction with band to band tunneling: first-principles investigation
A broken-gap heterojunction is a bright approach for designing tunneling field-effect transistors (TFETs) due to its distinct quantum tunneling mechanisms. In this study, we investigate the electronic structure and transport characteristics of a SiC/Ti 2 CO 2 heterojunction, as well as the impacts o...
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Veröffentlicht in: | Physical chemistry chemical physics : PCCP 2023-09, Vol.25 (35), p.23954-23962 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A broken-gap heterojunction is a bright approach for designing tunneling field-effect transistors (TFETs) due to its distinct quantum tunneling mechanisms. In this study, we investigate the electronic structure and transport characteristics of a SiC/Ti
2
CO
2
heterojunction, as well as the impacts of electric field and strain on the electronic properties
via
density functional theory. We determine that the interfacial atoms of the heterojunction are covalently bonded, forming a type-III heterojunction with a broken-gap. There exists band-to-band tunneling (BTBT) from the valence band (VB) of SiC to the conduction band (CB) of Ti
2
CO
2
. The creation of the heterojunction also enhances the carrier mobility arising from the large elastic modulus and the decrease of deformation potential. The current–voltage (
I
–
V
) characteristics of the device demonstrate a pronounced negative differential resistance (NDR) effect, along with a current that is about ten times greater than that of the vdW type-III heterojunction. Moreover, the tunneling window of SiC/Ti
2
CO
2
is only slightly altered when subjected to an external electric field and vertical strain, demonstrating the remarkable stability of its type-III band alignments. Our results indicate that the SiC/Ti
2
CO
2
heterojunction is useful to construct high-performance TFETs, and also introduces new ideas to design TFETs by using type-III covalent-bond heterojunctions. |
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ISSN: | 1463-9076 1463-9084 |
DOI: | 10.1039/D3CP03273F |