A lightweight thermally insulating and moisture-stable composite made of hollow silica particles

Thermal insulation materials are highly desirable for several applications ranging from building envelopes to thermal energy storage systems. A new type of low-cost insulation material called hollow silica particles (HSPs) was recently reported. The present work presents an HSP-based stand-alone composite that has very low thermal conductivity and is highly stable to moisture. A very low thermal conductivity and moisture stable composite made of hollow silica particles and cellulose fibers.