Electrocatalytic conversion of carbon dioxide to formic acid over nanosized Cu 6 Sn 5 intermetallic compounds with a SnO 2 shell layer
A novel ordered intermetallic compound of carbon-black-supported Cu 6 Sn 5 nanoparticles (Cu 6 Sn 5 NP/CB) in which Cu 6 Sn 5 has a NiAs-type structure was successfully prepared through a wet chemical method using lithium triethylborohydride as a reducing agent. The prepared ordered intermetallic co...
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Veröffentlicht in: | Catalysis science & technology 2019-11, Vol.9 (23), p.6577-6584 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A novel ordered intermetallic compound of carbon-black-supported Cu
6
Sn
5
nanoparticles (Cu
6
Sn
5
NP/CB) in which Cu
6
Sn
5
has a NiAs-type structure was successfully prepared through a wet chemical method using lithium triethylborohydride as a reducing agent. The prepared ordered intermetallic compound was characterized using X-ray diffraction (XRD), transmission electron microscopy, X-ray photoelectron spectroscopy (XPS), scanning transmission electron microscopy (STEM), and X-ray absorption fine structure spectroscopy (XAFS). The XRD measurements confirm the formation of the NiAs-type ordered intermetallic Cu
6
Sn
5
. XPS and STEM-X-ray energy dispersive spectroscopy measurements allowed us to confirm the Cu
6
Sn
5
structure. The surface of the intermetallic Cu
6
Sn
5
was found to be covered by SnO
2
, indicating that a core–shell structured intermetallic compound (
i.e.
, Cu
6
Sn
5
core/SnO
2
shell) had formed. The Cu
6
Sn
5
NP/CB material exhibited a faradaic efficiency of 65.3% at −0.6 V for HCOO
−
formation
via
electrochemical CO
2
reduction, which is superior to those of the non-intermetallic Cu NP/CB and Sn NP/CB samples. From the XAFS measurements, we determined the Sn–Sn distance in the SnO
2
on the surface of the Cu
6
Sn
5
NPs, and the key factor affecting the high selectivity was found to be the 4.9% compressive strain of the SnO
2
shell layers on the Cu
6
Sn
5
compared to that of the Sn NP/CB sample. |
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ISSN: | 2044-4753 2044-4761 |
DOI: | 10.1039/C9CY01540J |