Copper inks formed using short carbon chain organic Cu-precursors

Cu-based printing inks (20 wt% Cu) and (9.6 wt% Cu) were prepared using the short carbon chain organic Cu-precursors formed during the preparation of the inks, which can easily form a favorable conductive film onto glass slides at 290 °C and 220 °C. The resistance of the film induced by the oxidation of Cu and the remainder of the long carbon chain Cu-precursors markedly decreased, more than usual. The factors influencing the formation and conductive mechanism of the copper ink and film are discussed. Two kinds of copper ink were prepared using the short carbon chain organic Cu precursors formed during the preparation of the inks. The usual issues of low metallic loading and bad conductivity from long carbon chain Cu precursors were avoided.