Kinetic Control of Interparticle Spacing in Au Colloid-Based Surfaces:  Rational Nanometer-Scale Architecture

This paper details the kinetic aspects of covalent self-assembly of colloidal Au particles from solution onto immobilized organosilane polymers. On glass substrates, surface formation can be monitored using UV−vis spectroscopy and field emission scanning electron microscopy (FE-SEM). Correlation of...

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Veröffentlicht in:Journal of the American Chemical Society 1996-02, Vol.118 (5), p.1148-1153
Hauptverfasser: Grabar, Katherine C, Smith, Patrick C, Musick, Michael D, Davis, Jennifer A, Walter, Daniel G, Jackson, Michael A, Guthrie, Andrea P, Natan, Michael J
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Sprache:eng
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Zusammenfassung:This paper details the kinetic aspects of covalent self-assembly of colloidal Au particles from solution onto immobilized organosilane polymers. On glass substrates, surface formation can be monitored using UV−vis spectroscopy and field emission scanning electron microscopy (FE-SEM). Correlation of these data allows the effect of nanostructure on bulk optical properties to be evaluated. At short derivatization times, particle coverage is proportional to (time)1/2. The particle sticking probability p, defined as the ratio of bound particles to the number of particles reaching the surface in a given time period, can be determined from a knowledge of the particle radius, solution concentration, temperature, and solution viscosity; for surfaces derivatized with (3-mercaptopropyl)trimethoxysilane (MPTMS), p ≈ 1. At longer derivatization times, interparticle repulsions result in a “saturation” coverage at ≈30% of a close-packed monolayer. Two approaches for modulating the rate of surface formation are described:  electrochemical potential control on organosilane-modified SnO2 electrodes and charge screening by organic adsorbates. Self-assembly of colloidal Au particles onto functionalized substrate surfaces is a reproducible phenomenon, as evidenced by UV−vis and surface enhanced Raman scattering (SERS) measurements on identically prepared substrates.
ISSN:0002-7863
1520-5126
DOI:10.1021/ja952233+